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Ion Implantation and Synthesis of Materials - Studium

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2 1 General Features <strong>and</strong> Fundamental Concepts<strong>Ion</strong> Source<strong>Ion</strong> AccelerationMassSeparationBeamSweepingTarget ChamberFig. 1.1. Schematic drawing <strong>of</strong> an ion implantation system. A mass-separating magnet isused to select the ion species (elements <strong>and</strong> isotopes) <strong>of</strong> interest. Beam-sweeping facilitiesare required for large-area uniform implantations1.2 Range DistributionsOne <strong>of</strong> the most important considerations in any description <strong>of</strong> ion–solidinteractions is the depth (range) distribution <strong>of</strong> the implanted ions. A large amount<strong>of</strong> experimental <strong>and</strong> theoretical work has been devoted to the task <strong>of</strong> underst<strong>and</strong>ingthe energy-loss processes that govern the range distribution, <strong>and</strong> it is nowpossible to predict fairly accurately most <strong>of</strong> the factors involved. For example, atypical range distribution in an amorphous substrate from monoenergetic ions atmoderate ion doses is approximately Gaussian in shape <strong>and</strong> may therefore becharacterized by a projected range, R p , <strong>and</strong> a straggling, ∆R p , about this meanvalue, as depicted in Fig. 1.2. The notation uses Z <strong>and</strong> M for atomic number <strong>and</strong>atomic mass, respectively, with subscript 1 denoting the incident ions (Z 1 , M 1 ) <strong>and</strong>subscript 2 denoting the ion-bombarded sample (or target). By convention, theenergy <strong>of</strong> the incident ion is denoted by E 0 or by E without a subscript.

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