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Ion Implantation and Synthesis of Materials - Studium

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138 10 Crystallization <strong>and</strong> Regrowth <strong>of</strong> Amorphous Sitemperatures as low as 250°C at a rate <strong>of</strong> 0.007 nm s −1 . with an irradiation <strong>of</strong>600 keV Kr at a dose rate <strong>of</strong> 1 × 10 12 Kr cm −2 s −1 . At this temperature the purethermal regrowth rate is negligible (~10 −11 nm s −1 ).As shown in Fig. 10.10, the ion beam-induced regrowth <strong>of</strong> amorphous Sidepends on the energy density deposited into nuclear collisions, as demonstratedby the correlation between the growth rate <strong>and</strong> the number <strong>of</strong> vacancies generatedby the 600 keV Kr beam irradiation. (Vacancies were calculated by the SRIMcode.) This trend suggests that the ion-induced growth rate is coupled with theproduction <strong>of</strong> point defects, or in a more general way, with the energy lost throughelastic collisions at the α–c interface by the impinging ions.The role <strong>of</strong> the α–c interface in <strong>Ion</strong> Beam Induced Epitaxial Crystallization(IBIEC) is demonstrated in Fig. 10.11, which shows that the regrowth rate isorientation dependent. The data shows that the rate is much lower (almost by afactor <strong>of</strong> 4) for 〈111〉 substrates relative to 〈100〉 substrates. These results suggestthat the same interfacial defects that are responsible for thermal regrowth also areimportant in IBIEC, with the role <strong>of</strong> the ion beam being that <strong>of</strong> changing theaverage defect concentration.The dependence <strong>of</strong> the growth rate on temperature is illustrated in Fig. 10.12,for both IBIEC <strong>and</strong> thermal annealing. The growth rate is reported both in Å s −1 .2.5Growth Rate [nm/(10 13 at/cm 2 )]2.0151.510TRIM1.050.50.00 25 50 75 100 125Depth (nm)Vacancies (#/ion/nm )Fig. 10.10. Growth rate versus depth for an α−Si layer recrystallized at 350°C by 600 Krions (after Priolo et al. 1989)

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