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Ion Implantation and Synthesis of Materials - Studium

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124 9 Doping, Diffusion <strong>and</strong> Defects in <strong>Ion</strong>-Implanted Sidirection, the depth pr<strong>of</strong>ile <strong>of</strong> interstitials would naturally be slightly deeper thanthat <strong>of</strong> the vacancies. SRIM simulations <strong>of</strong> 50 keV or 500 keV Si implanted intoSi reveals the formation <strong>of</strong> a net vacancy-rich region with a depth <strong>of</strong> about half <strong>of</strong>the Si projected range. The average separation between vacancy locations <strong>and</strong>interstitial locations increases when the implantation energy increases.The implantation <strong>of</strong> MeV Si ions into a Si substrate can also suppress boronenhanceddiffusion normally associated with a high boron concentration layer(Shao et al. 2003). Junction depths <strong>of</strong> 20 nm were achieved in samples implantedwith 0.5 keV B ion at a dose <strong>of</strong> 10 15 cm −2 following a 1,000°C thermal anneal.9.6 Irradiation-Enhanced Diffusion<strong>Ion</strong> irradiation is quite efficient in forming vacancy-interstitial pairs, as shownin Chap. 7 <strong>and</strong> in the simulation in the previous sections. The atomic displacementsresulting from energetic recoiling atoms can be highly concentrated intosmall, localized regions containing large concentrations <strong>of</strong> defects well in excess<strong>of</strong> the equilibrium value. If the defects are produced at temperatures where theyare mobile <strong>and</strong> can, in part, anneal out, the balance between the rate formation <strong>and</strong>the rate <strong>of</strong> annihilation leads to a steady state <strong>of</strong> excess concentration <strong>of</strong> defects.Since the atomic diffusivity is proportional to the defect concentration, an excessconcentration <strong>of</strong> defects leads to an enhancement in the diffusion process.Enhanced diffusion has been found in Si. It is featured in alloys. Atomic motionin most metals <strong>and</strong> solid-solution alloys usually occurs by the interchange betweenatoms <strong>and</strong> neighboring vacant sites. For such a diffusion process, the atomicdiffusion coefficient is given byD =Γ d 2 / 6(9.7)(Shewmon 1963), where Γ is the atomic jump frequency for uncorrelated jumps,<strong>and</strong> d is the atomic jump distance. For diffusion driven by the vacancymechanism, Γ is given byΓ = fCv vΓ v(9.8)where C v is the vacancy concentration, Γ v is the vacancy jump frequency, which isvvproportional to exp − Em/ kBT , where Em is the vacancy migration energy, <strong>and</strong>f v is a correlation factor (which is nearly unity).The vacancy diffusion coefficient can be described by an expression similar tothe atomic diffusion coefficient,

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