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Session 2.2 Thermal measurements and analysis 7-9 October 7-9 October 2009, 2009, Leuven, Leuven, Belgium Belgium Temperature as as a First-Class a Citizen Citizen in Chip in Chip Design Design Pixel-by-Pixel Calibration of a CCD Sachin Camera Sachin S. Sapatnekar Based S. Sapatnekar Thermoreflectance Thermography System with Nanometer Resolution............................................................................................................ University University of Minnesota, of Minnesota, 130 USA Mihai G. Burzo, Pavel L. Komarov, Peter E. Raad USA Practical Study of Temperature Distribution in a Thermal Test Integrated Circuit.... 136 M. Janicki, M. Szermer, S. Klab, Z. Kulesza, A. Napieralski Abstract- Abstract- CMOS Temperature With new With technology new technology Sensors trends, trends, Based arising arising on through through Thermal a a Diffusion................................................................. 140 confluence confluence Caspar of van factors of factors Vroonhoven, such as such as Moore's law scaling and 3D integration, the role of thermal Mahdi Moore's Kashmiri, law scaling design is inexorably Kofi Makinwa and 3D integration, the role of thermal design is inexorably shifting shifting from from package-centric package-centric issues issues towards towards on-chip on-chip optimizations. optimizations. This talk This talk overviews High-Level overviews the roots the Thermal of roots this of change, this Profiling change, the circuit the circuit effects of Mobile effects of elevated of Applications...................................................................... elevated 144 temperatures, Marius temperatures, Marcu and on-chip and on-chip optimizations optimizations for effective for effective thermal thermal management. management. Session 2.3 Advanced cooling techniques I Text unavailable Text unavailable at the time at the of time printing. of printing. Hotspot-adapted Cold Plates to Maximize System Efficiency...................................................... 150 Thomas Brunschwiler, Hugo Rothuizen, Stephan Paredes, and B. Michel, Evan Colgan, Pepe Bezama Optimal Channel Width Distribution of Single-Phase Microchannel Heat Sinks.............. 157 T. Van Oevelen, F. Rogiers, M. Baelmans Heat transfer enhancement due to pulsating flow in a microchannel heat sink........... 163 T. Persoons, T. Saenen, R. Donose, M. Baelmans Hot Spot Targeting with a Liquid Impinging Jet Array Waterblock........................................... 168 D. Nikolić, M. Hutchison, P.T. Sapin, A.J. Robinson Session 2.4 Advanced cooling techniques II Towards a Dynamic System Model for a Two-Phase Cooling Loop Using Microchannels....174 T. Saenen, T. Delesie, T. Persoons, M. Baelmans Heat transfer and film thickness measurements in a closed loop spray cooling system with R134a.................................................................................................................................................... 180 Eduardo Martínez-Galván, Juan Carlos Ramos, Raúl Antón, Björn Palm Thermal Management of a 3D Chip Stack using a Liquid Interface to a Synthetic Jet Cooled Spreader.............................................................................................................................................. 186 Krishna Kota, Pablo Hidalgo, Yogendra Joshi, Ari Glezer ©EDA ©EDA Publishing/THERMINIC Publishing/THERMINIC 2009 2009 IX 1 1 ISBN: ISBN: 978-2-35500-010-2 978-2-35500-010-2
7-9 October 7-9 October 2009, 2009, Leuven, Leuven, Belgium Belgium Temperature as as a First-Class a Citizen Citizen in Chip in Chip Design Design Friday 9 October 2009 Sachin Sachin S. Sapatnekar S. Sapatnekar Session 3.1 Special session: Nanopack I University University of Minnesota, of Minnesota, USA USA Presentation and status of the NANOPACK project.............................................................................. 192 A. Ziaei, S. Demoustier Electro-Thermal Modeling of Nano-Scale Devices............................................................................ 195 D. Abstract- Vasileska, Abstract- With K. Raleva, new With technology new S. M. technology Goodnick trends, trends, arising arising through through a a confluence confluence of factors of factors such as such Moore's as Moore's law scaling law scaling and 3D and 3D integration, Effects integration, of the role Quantum the of role thermal of thermal Corrections design design is inexorably is inexorably and shifting Isotope shifting from Scattering from on Silicon Thermal package-centric package-centric issues towards on-chip optimizations. This talk Properties.................................................................................................................................................................... issues towards on-chip optimizations. This talk 197 overviews overviews the roots of this change, the circuit effects of elevated Javier temperatures, V. Goicochea, the roots of and Marcela this change, on-chip Madrid, the circuit optimizations Cristina effects for Amon of elevated temperatures, and on-chip optimizations for effective effective thermal thermal management. management. Directional Thermal Conductivity of a Thin Si Suspended Membrane with Stretched Ge Quantum Dots..................................................................................................................................................... 203 Jean-Numa Text Gillet, unavailable Bahram at Djafari-Rouhani, the time of printing. Yan Pennec Text unavailable at the time of printing. Invited speaker: Vladimir Székely BUTE, Hungary Thermal Transient Measurements: the State of the Art................................................................. 209 Vladimir Székely Session 3.2 Special session: Nanopack II (Thermal interface materials) Characterization of Metal Micro-Textured Thermal Interface Materials........................ 210 Roger Kempers, Anthony Robinson, Alan Lyons Carbon Nanotube Enhanced Thermally Conductive Phase Change Material For Heat Dissipation............................................................................................................................................... 216 Xinhe Tang, Ernst Hammel, Werner Reiter Method for In-Situ Reliability Testing of TIM Samples..................................................................... 219 Andras Vass-Varnai, Zoltan Sarkany, Marta Rencz Progress in Thermal Characterisation Methods and Thermal Interface Technology within the “Nanopack” Project..........................................................................................................................224 B. Wunderle, M. Abo Ras, M. Klein, R. Mrossko, G. Engelmann, D. May, O. Wittler, R. Schacht, L. Dietrich, H. Oppermann, B. Michel Autor Index....................................................................................................................................................................... 233 ©EDA ©EDA Publishing/THERMINIC Publishing/THERMINIC 2009 2009 1X 1 ISBN: ISBN: 978-2-35500-010-2 978-2-35500-010-2
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