27.01.2015 Views

Online proceedings - EDA Publishing Association

Online proceedings - EDA Publishing Association

Online proceedings - EDA Publishing Association

SHOW MORE
SHOW LESS

You also want an ePaper? Increase the reach of your titles

YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.

RA (m 2 K/W)<br />

0.0008<br />

0.0007<br />

0.0006<br />

0.0005<br />

0.0004<br />

0.0003<br />

0.0002<br />

0.0001<br />

0<br />

C2<br />

A3<br />

C1<br />

B3<br />

D2<br />

A1<br />

B1<br />

0 0.5 1 1.5 2 2.5 3<br />

Pressure @ 50% Strain (MPa)<br />

D1<br />

F3<br />

7-9 October 2009, Leuven, Belgium<br />

measurements will be required. Future work will also involve<br />

validating the simultaneous thermal-mechanical numerical<br />

model developed by Kempers et al. [6] with this data.<br />

Additionally, characterization the thermal contact resistance<br />

of these MMT-TIMs as they deform is essential to<br />

understating their performance and for the design of optimum<br />

MMT-TIMs for a given application. Present work revolves<br />

around understanding the relationship between electrical and<br />

thermal contact resistance for these deformable metal<br />

structures in order to develop a simple electrical<br />

measurement to estimate the thermal contact resistance of<br />

MMT-TIMs.<br />

ACKNOWLEDGMENTS<br />

This work was supported by IDA Ireland. Special thanks<br />

to Paul Ahern of Alcatel-Lucent for the SEM imaging.<br />

Fig. 9: Variation of specific thermal resistance with pressure at 50%<br />

strain for each MMT-TIM<br />

resistances of the bulk MMT-TIM are extremely small<br />

compared to the resistance at the contact surfaces. For these<br />

MMT-TIMs, it has been proposed that a relatively<br />

straightforward electrical resistance measurement be<br />

employed to characterize the thermal contact resistance [6,7].<br />

Work is presently being carried out in order to characterize<br />

the relationship between thermal and electrical contact<br />

resistance of deformable metal structures for this purpose.<br />

V. CONCLUSIONS & FUTURE OUTLOOK<br />

Several different hollow conical MMT-TIM structures<br />

were characterized experimentally. The results explore the<br />

effect of various geometrical parameters such as metal<br />

thickness, feature height, size, density and shape on both the<br />

mechanical and thermal response of the MMT-TIM. Overall,<br />

these parameters can exhibit a definite influence both the<br />

thermal and mechanical response of the TIM.<br />

Generally speaking, MMT-TIMs with thicker metal<br />

plating (foil thickness) exhibit a stiffer mechanical response<br />

and a slightly higher effective thermal conductivity.<br />

Additionally, stiffer structures and MMT-TIMs with high<br />

density feature arrays can exhibit higher effective thermal<br />

conductivities but also higher thermal resistances due to<br />

lower compressibility in the structure.<br />

The best overall TIM performance was achieved<br />

through a trade-off between effective thermal conductivity<br />

and mechanical compliance. This was achieved with sample<br />

“D2” where a dense array of conical features formed an<br />

interface of multiple, redundant, thermal contacts. Due to the<br />

thin metal plating, the features plastically deform relatively<br />

easily providing good compliance and a large interfacial<br />

contact area. Thicker metal plating does further reduce<br />

thermal resistance of the MMT-TIM, but only at the price of<br />

significantly higher assembly pressures.<br />

The present work represents an initial exploration into<br />

the effects of various MMT-TIM geometries on the<br />

mechanical and thermal properties. Although some<br />

performance trends were demonstrated, the tested structures<br />

are far from optimal. Additional experimental structures and<br />

REFERENCES<br />

[1] Liu, J., Michel, B., Rencz, M., Tantolin, C, Sarno, C., Miessner, R.,<br />

Schuett, K-V., Tang, X., Demoustier, S. & Ziaei, A., “Recent Progress<br />

of Thermal Interface Material Research—An Overview”, Proceedings of<br />

the 14 th Workshop on Thermal Issues in ICs and Systems<br />

(THERMINIC), Rome, Italy, September 24-26, 2008<br />

[2] Smith B., Brunschwiler, T., & Michel, B. “Comparison of transient and<br />

static test methods for chip-to-sink thermal interface characterization”.<br />

Microelectron. J., doi:10.1016/j.mejo.2008.06.079 (2008).<br />

[3] Linderman, R., Brunschwiler, T., Smith B., and Michel, B. “High<br />

performance thermal interface technology overview”. Proceedings of the<br />

13 th Workshop on Thermal Issues in ICs and Systems (THERMINIC),<br />

pp. 129-134 (2007).<br />

[4] Ziaei, A. & Demoustier, S., “NANOPACK – Nano Packaging<br />

Technology for Interconnect and Heat Dissipation”. Proceedings of the<br />

14 th Workshop on Thermal Issues in ICs and Systems (THERMINIC),<br />

Rome, Italy, September 24-26, 2008.<br />

[5] Liu, J., Michel, B., Rencz, M., Tantolin, C., Sarno, C., Miessner, R.,<br />

Schuett, K. V., Tang, X., Demoustier, S. & Ziaei, A. “Recent Progress<br />

of Thermal Interface Material Research – An Overview”. Proceedings of<br />

the 14 th Workshop on Thermal Issues in ICs and Systems<br />

(THERMINIC), Rome, Italy, September 24-26, 2008.<br />

[6] Kempers, R., Frizzell, R., Lyons, A. & Robinson, A.J., “Development of<br />

a Metal Micro-Textured Thermal Interface Material”, ASME<br />

InterPACK Conference, IPACK2009-89366, San Francisco, July 8-12,<br />

2009<br />

[7] Kempers, R., Kolodner, P., Lyons, A. & Robinson, A.J. “A High-<br />

Precision Apparatus for the Characterization of Thermal Interface<br />

Materials” Accepted to Review of Scientific Instruments, (2009).<br />

[8] Teertstra, P. “Thermal Conductivity and Contact Resistance<br />

Measurements for Adhesives”. Proceedings of ASME InterPACK 2007,<br />

Vancouver, BC, July 8-12, 2007.<br />

[9] Madhusudana, C.V., Thermal Contact Conductance, Springer-Verlag,<br />

New York, (1996).<br />

[10] Braunovic, M., Konchits, V.V. &Myshkin, N.K., Electrical Contacts:<br />

Fundamentsl, Aplications and Technology, CRC Press, (2007).<br />

©<strong>EDA</strong> <strong>Publishing</strong>/THERMINIC 2009 215<br />

ISBN: 978-2-35500-010-2

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!