Online proceedings - EDA Publishing Association
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RA (m 2 K/W)<br />
0.0008<br />
0.0007<br />
0.0006<br />
0.0005<br />
0.0004<br />
0.0003<br />
0.0002<br />
0.0001<br />
0<br />
C2<br />
A3<br />
C1<br />
B3<br />
D2<br />
A1<br />
B1<br />
0 0.5 1 1.5 2 2.5 3<br />
Pressure @ 50% Strain (MPa)<br />
D1<br />
F3<br />
7-9 October 2009, Leuven, Belgium<br />
measurements will be required. Future work will also involve<br />
validating the simultaneous thermal-mechanical numerical<br />
model developed by Kempers et al. [6] with this data.<br />
Additionally, characterization the thermal contact resistance<br />
of these MMT-TIMs as they deform is essential to<br />
understating their performance and for the design of optimum<br />
MMT-TIMs for a given application. Present work revolves<br />
around understanding the relationship between electrical and<br />
thermal contact resistance for these deformable metal<br />
structures in order to develop a simple electrical<br />
measurement to estimate the thermal contact resistance of<br />
MMT-TIMs.<br />
ACKNOWLEDGMENTS<br />
This work was supported by IDA Ireland. Special thanks<br />
to Paul Ahern of Alcatel-Lucent for the SEM imaging.<br />
Fig. 9: Variation of specific thermal resistance with pressure at 50%<br />
strain for each MMT-TIM<br />
resistances of the bulk MMT-TIM are extremely small<br />
compared to the resistance at the contact surfaces. For these<br />
MMT-TIMs, it has been proposed that a relatively<br />
straightforward electrical resistance measurement be<br />
employed to characterize the thermal contact resistance [6,7].<br />
Work is presently being carried out in order to characterize<br />
the relationship between thermal and electrical contact<br />
resistance of deformable metal structures for this purpose.<br />
V. CONCLUSIONS & FUTURE OUTLOOK<br />
Several different hollow conical MMT-TIM structures<br />
were characterized experimentally. The results explore the<br />
effect of various geometrical parameters such as metal<br />
thickness, feature height, size, density and shape on both the<br />
mechanical and thermal response of the MMT-TIM. Overall,<br />
these parameters can exhibit a definite influence both the<br />
thermal and mechanical response of the TIM.<br />
Generally speaking, MMT-TIMs with thicker metal<br />
plating (foil thickness) exhibit a stiffer mechanical response<br />
and a slightly higher effective thermal conductivity.<br />
Additionally, stiffer structures and MMT-TIMs with high<br />
density feature arrays can exhibit higher effective thermal<br />
conductivities but also higher thermal resistances due to<br />
lower compressibility in the structure.<br />
The best overall TIM performance was achieved<br />
through a trade-off between effective thermal conductivity<br />
and mechanical compliance. This was achieved with sample<br />
“D2” where a dense array of conical features formed an<br />
interface of multiple, redundant, thermal contacts. Due to the<br />
thin metal plating, the features plastically deform relatively<br />
easily providing good compliance and a large interfacial<br />
contact area. Thicker metal plating does further reduce<br />
thermal resistance of the MMT-TIM, but only at the price of<br />
significantly higher assembly pressures.<br />
The present work represents an initial exploration into<br />
the effects of various MMT-TIM geometries on the<br />
mechanical and thermal properties. Although some<br />
performance trends were demonstrated, the tested structures<br />
are far from optimal. Additional experimental structures and<br />
REFERENCES<br />
[1] Liu, J., Michel, B., Rencz, M., Tantolin, C, Sarno, C., Miessner, R.,<br />
Schuett, K-V., Tang, X., Demoustier, S. & Ziaei, A., “Recent Progress<br />
of Thermal Interface Material Research—An Overview”, Proceedings of<br />
the 14 th Workshop on Thermal Issues in ICs and Systems<br />
(THERMINIC), Rome, Italy, September 24-26, 2008<br />
[2] Smith B., Brunschwiler, T., & Michel, B. “Comparison of transient and<br />
static test methods for chip-to-sink thermal interface characterization”.<br />
Microelectron. J., doi:10.1016/j.mejo.2008.06.079 (2008).<br />
[3] Linderman, R., Brunschwiler, T., Smith B., and Michel, B. “High<br />
performance thermal interface technology overview”. Proceedings of the<br />
13 th Workshop on Thermal Issues in ICs and Systems (THERMINIC),<br />
pp. 129-134 (2007).<br />
[4] Ziaei, A. & Demoustier, S., “NANOPACK – Nano Packaging<br />
Technology for Interconnect and Heat Dissipation”. Proceedings of the<br />
14 th Workshop on Thermal Issues in ICs and Systems (THERMINIC),<br />
Rome, Italy, September 24-26, 2008.<br />
[5] Liu, J., Michel, B., Rencz, M., Tantolin, C., Sarno, C., Miessner, R.,<br />
Schuett, K. V., Tang, X., Demoustier, S. & Ziaei, A. “Recent Progress<br />
of Thermal Interface Material Research – An Overview”. Proceedings of<br />
the 14 th Workshop on Thermal Issues in ICs and Systems<br />
(THERMINIC), Rome, Italy, September 24-26, 2008.<br />
[6] Kempers, R., Frizzell, R., Lyons, A. & Robinson, A.J., “Development of<br />
a Metal Micro-Textured Thermal Interface Material”, ASME<br />
InterPACK Conference, IPACK2009-89366, San Francisco, July 8-12,<br />
2009<br />
[7] Kempers, R., Kolodner, P., Lyons, A. & Robinson, A.J. “A High-<br />
Precision Apparatus for the Characterization of Thermal Interface<br />
Materials” Accepted to Review of Scientific Instruments, (2009).<br />
[8] Teertstra, P. “Thermal Conductivity and Contact Resistance<br />
Measurements for Adhesives”. Proceedings of ASME InterPACK 2007,<br />
Vancouver, BC, July 8-12, 2007.<br />
[9] Madhusudana, C.V., Thermal Contact Conductance, Springer-Verlag,<br />
New York, (1996).<br />
[10] Braunovic, M., Konchits, V.V. &Myshkin, N.K., Electrical Contacts:<br />
Fundamentsl, Aplications and Technology, CRC Press, (2007).<br />
©<strong>EDA</strong> <strong>Publishing</strong>/THERMINIC 2009 215<br />
ISBN: 978-2-35500-010-2