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Table of Contents Sachin Sachin S. Sapatnekar S. Sapatnekar Wednesday University University of 7 Minnesota, of Minnesota, October 2009 USA USA Invited speaker: Sachin S. Sapatnekar, University of Minnesota, USA Temperature as a First-Class Citizen in Chip Design................................................................................ 1 Sachin S. Sapatnekar Abstract- Abstract- Session With 1.1 Thermal new With technology new technology modelling: trends, trends, arising arising System through through levela a confluence confluence of factors of factors such as such Moore's as Moore's law scaling law scaling and 3D and 3D integration, integration, the role the of role thermal of thermal design design is inexorably is inexorably shifting shifting from from package-centric Toward package-centric a issues Rational issues towards towards Modeling on-chip on-chip optimizations. of optimizations. Convection.............................................................................................. This talk This talk 2 overviews M. overviews N. Sabry the roots the of roots this of change, this change, the circuit the circuit effects effects of elevated of elevated temperatures, temperatures, and on-chip and on-chip optimizations optimizations for effective for effective thermal thermal management. management. Equivalent Electrothermal Circuit Model for Vertical-Cavity Surface-Emitting Lasers on Silicon Optical Bench........................................................................................................................ 8 C. C. Chen, C. Singh, Y. C. Chen, Hsu-Liang Hsiao, Chia-Yu Lee, Y. T. Cheng, Mount-Learn Wu Text unavailable Text unavailable at the time at the of time printing. of printing. Geothermal Cooling Solution Research For Outdoor Cabinet.................................................... 13 Yuping Hong, Yuening Li, Jian Shi A New Methodology for Early Stage Thermal Analysis of Complex Electronic Systems........................................................................................................................................................................... 17 O. Martins, N. Peltier, S. Guédon, S. Kaiser, Y. Marechal, Y. Avenas Session 1.2 Thermal modelling and simulation: IC level Validation Studies of DELPHI-type Boundary - Condition-Independent Compact Thermal Model for an Opto-Electronic Package.................................................................................. 23 Arun P. Raghupathy, Attila Aranyosi, William Malt Spatial and temporal temperature variations in CMOS designs.................................................... 31 J.H.J.Janssen, H.J.M.Veendrick Numerical Simulation of Complex Submicron Devices with Experimentally Determined Power Maps........................................................................................................................................ 36 Peter E. Raad, Mihai G. Burzo, Pavel L. Komarov Design Modeling and Simulation of Electrothermally Actuated Microgyroscope Fabricated using the MetalMUMPs.................................................................................................................. 40 Rana I. Shakoor, Shafaat A. Bazaz, M. M. Hasan Session 1.3 Thermal simulation: 3D chip architectures 7-9 October 7-9 October 2009, 2009, Leuven, Leuven, Belgium Belgium Temperature as as a First-Class a Citizen Citizen in Chip in Chip Design Design Fine Grain Thermal Modeling of 3D Stacked Structures.................................................................. 45 H. Oprins, M. Cupak, G. Van der Plas, P. Marchal, B. Vandevelde, A. Srinivasan, E. Cheng Emulation-Based Transient Thermal Modeling of 2D/3D Systems-on-Chip with Active Cooling........................................................................................................................................................................... 50 David Atienza Thermal Analysis of Hot Spots in Advanced 3DStacked Structures........................................... 56 C. Torregiani, B. Vandevelde, H. Oprins, E. Beyne, I. De Wolf ©EDA ©EDA Publishing/THERMINIC Publishing/THERMINIC 2009 2009 VII 1 1 ISBN: ISBN: 978-2-35500-010-2 978-2-35500-010-2
Poster session: Introduction* 7-9 October 7-9 October 2009, 2009, Leuven, Leuven, Belgium Belgium Temperature as as a First-Class a Citizen Citizen in Chip in Chip Design Design Thermal Issues of Solar Irradiation Sensor............................................................................................ Sachin Sachin S. Sapatnekar S. Sapatnekar 61 B. Plesz, Á. Földváry, E. Bándy University University of Minnesota, of Minnesota, USA USA Thermal Simulation and Package Investigation of Wireless Gas Sensors Microsystems... 66 Andrea Paoli, Lucia Seminara, Daniele D. Caviglia, Alessandro Garibbo, Maurizio Valle Electro-thermal simulation: a new Subsystem in Mentor Graphics IC Design Flow......... 70 K.O. Abstract- Abstract- Petrosjanc, With new With N.I. Ryabov, technology new technology I.A. trends, trends, Kharitonov, arising arising P.A. through through Kozynkoa a confluence confluence of factors of factors such as such Moore's as Moore's law scaling law scaling and 3D and 3D integration, integration, the role the of role thermal of thermal design design is inexorably is inexorably shifting shifting from from package-centric Thermoelectric package-centric issues issues towards Energy towards on-chip Scavenging on-chip optimizations. optimizations. from This Waste talk This talk Heat of Power Amplifier Transistors..... 75 overviews Kyoung overviews Joon the roots Kim, the of roots Marc this of Hodes change, this change, the circuit the circuit effects effects of elevated of elevated temperatures, temperatures, and on-chip and on-chip optimizations optimizations for effective for effective thermal thermal management. management. Practical Realization of PTAT Sensor for ASIC Overheat Protection ........................................ 80 M. Szermer, M. Janicki, Z. Kulesza, A. Napieralski Thermo-Mechanical Text unavailable Text unavailable at the time at the Reliability of time printing. of printing. Loop In Device Modeling................................................................ 84 T. Bieniek, G. Janczyk, P. Grabiec, J. Szynka A Temperature-Dependent POWER MOSFET Mode1 for Switching Application........................... 87 H. DIA, J.B. Sauveplane, P. Tounsi, J-M. Dorkel Crack Tip Localization of Sub-critical Crack Growth by Means of IR-Imaging and Pulse Excitation............................................................................................................................................... 91 D. May, B. Wunderle, R. Schacht, B. Michel Thermal matching of a thermoelectric energy harvester with the environment and its application in wearable self-powered wireless medical sensors............................. 95 V. Leonov, P. Fiorini, T. Torfs, R. J. M. Vullers, C. Van Hoof Thursday 8 October 2009 Invited speaker: Suresh V. Garimella Purdue University, West Lafayette, USA Boiling Heat Transfer and Flow Regimes in Microchannels – a Comprehensive Understanding......................................................................................................................................................... 101 Suresh V. Garimella, Tannaz Harirchian Session 2.1 Coupled modelling: electro/thermo/mechanical Impact of Moisture Absorption on Warpage of Large BGA packages during a lead-free reflow process.............................................................................................................................. 113 B. Vandevelde, R. Deweerdt, F. Duflos, M. Gonzalez, D. Vanderstraeten, Eddy Blansaer, Guy Brizar, Renaud Gillon Evaluation of Materials for High Temperature IC Packaging...................................................... 117 Robert Klieber, Renee Lerch Electro-thermal modeling of different LEP-thickness white OLEDs....................................... 121 Ernő Kollár, Gusztáv Hantos Electro-Thermal Simulation of Multi-channel Power Devices on PCB with SPICE............ 124 Torsten Hauck, Wim Teulings, Evgenii Rudnyi ©EDA ©EDA Publishing/THERMINIC Publishing/THERMINIC 2009 2009 VIII 1 1 ISBN: ISBN: 978-2-35500-010-2 978-2-35500-010-2
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III. SUMMARY In this study it was s
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