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Online proceedings - EDA Publishing Association

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7-9 October 2009, Leuven, Belgium<br />

REFERENCES<br />

[1] H. Pape, et al., “Thermal Transient Modeling and Experimental<br />

Validation in the European Project PROFIT”, IEEE transactions on<br />

Components and Packaging Technologies, Vol. 27, No 3,<br />

September 2004<br />

[2] Peng Li, et al., “Efficient Full-Chip Thermal Modeling and<br />

Analysis” IEEE/ACM International Conference on Computer Aided<br />

Design (ICCAD-2004), 2004<br />

[3] T. Sato, et al., “On-Chip Thermal Gradient Analysis Considering<br />

Interdependence between Leakage Power and Temperature”, IEICE<br />

Trans, Fundamentals, Vol.E89-A, No 12 Dec. 2006<br />

[4] R.S.C. Cobbold, `Theory and applications of field effect transistors',<br />

John Wiley & Sons, Inc. New York<br />

[5] I.M. Filanovsky, A. Allam, “Mutual Compensation of Mobility and<br />

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Circuits”, IEEE Transactions on Circuits and Systems:<br />

Fundamental Theory and Applications, vol.48, no.7, pp. 876-884,<br />

July 2001<br />

[6] A. Dasnan, et al., “ Handling Inverted Temperature Dependence in<br />

Static Timing Analysis”, ACM Transactions on Design<br />

Automationof Electronic Systems, Vol. 11, No. 2, April 2006, pp.<br />

306-324<br />

[7] H.Veendrick, “Nanometer CMOS ICs, from Basics to ASICs”,<br />

Springer, 2008, ISBN 978-1-4020-8332-7, pp. 71-73<br />

[8] R. Kumar, et al., “Reversed Temperature-Dependent Propagation<br />

Delay Characteristics in Nanometer CMOS Circuits”, IEEE<br />

Transactions on Circuits and Systems-II: Express Briefs, Vol. 11,<br />

No.2, April 2006, pp. 1078-1082<br />

[9] E. Long, et al. “Detection of Temperature Sensitive Defects Using<br />

ZTC”, Proceedings of 22nd IEEE VLSI Test Symposium (VTS<br />

2004)<br />

©<strong>EDA</strong> <strong>Publishing</strong>/THERMINIC 2009 35<br />

ISBN: 978-2-35500-010-2

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