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close already to the literature value of a theoretically possible 420 W/mK for pure silver. To estimate the accuracy of the method, we have calculated its sensitivity first. This can then be compared to the mean accuracy of the temperature measurement δT fitted for the three sensor values along the Cu-bar. The sensitivity of the method is expected to depend on the BLT of the TIM. The simulated curves are given in figure 21 for different TIM-conductivities and BLTs. Naturally the sensitivity is higher for the larger BLT and yields the value of S = 0.0046 mK 2 /W. With δT = 0.045 K we obtain a resolution of around δλ = ± 10 K for the thicker BLT. 7-9 October 2009, Leuven, Belgium introduced by the technological modifications. The accuracy obtainable at low bond-line thicknesses and highly conductive interface materials is evaluated and commented on. More results will follow and be presented soon in another paper, encompassing also reliability aspects of the new technologies. ACKNOWLEDGMENTS The authors appreciate the support of the EU FP 7 Integrated Project “Nanopack”. Further thanks go to the authors’ Fraunhofer colleagues A. Gollhardt, S. Huber, M. Koch, K.-F. Becker, T. Braun and M. von Suchodolez. ∆T [K] 0.12 0.10 0.08 0.06 0.04 0.02 0.00 -0.02 -0.04 BLT = 28 µm BLT = 71 µm 390 395 400 405 410 415 420 λ Ag [W/mK] Fig 21: Sensitivity of measurements for two different BLT For the thinner BLT we obtain δλ = ± 20 W/mK. This means that preferably thick BLTs should be used during characterisation. However, large BLTs of Ag powder are difficult to realise technologically. CONCLUSIONS & OUTLOOK In this paper we have stressed the need for advanced thermal interface technology and presented two approaches to process and characterize theses structures. A so-called “nano-sponge” technology has been introduced with interesting structural, mechanical and thermal features to enhance heat transfer across the interface. Nanoindentation has been used to verify the increased deformability of the sponge to possibly allow enhanced contact to filler particles. A second technology using Ag-powder on Ag surface metallisation has been presented and tested successfully thermally and mechanically. It has also been pointed out that usually a variety of characterisation methods is made necessary as each new interface technology has to be thermally measured as processed in the real device. In this vein two test stands have been designed and developed to measure the effect REFERENCES [1] R. Viswanath, V. Wakharkar, A. Watwe and V. Lebonheur. Thermal Performance Requirements from Silicon to Systems. Intel Technology Journal Q3, pp. 1- 16, 2000. [2] S.V. Garimella, Y.K. Joshi, A. Bar-Cohen, R. Mahajan, K.C. Toh, V.P. Baelmans, J. Lohan, B. Sammakia, and F. Andros. Thermal challenges in next generation electronic systems – summary of panel presentations and discussions. IEEE Trans. Components and Packaging Technologies, 25(4), pp. 569–575, 2002. [3] Liu, Y., S. Irving, T. Luk, and D. Kinzer. Trends of Power Electronics Packaging and Modeling. Proc. 10th EPTC, 2008. [4] M. Rencz. Testing interface thermal resistance, Proc. 9th EPTC, 2007. [5] R. Schacht, D. May, B. Wunderle, O. Wittler, A. Gollhardt, B. Michel and H. Reichl. Characterization of Thermal Interface Materials to Support Thermal Simulation. Proc. 12th Therminic 2006, Sep 27-29, Nice, Côte d’Azur, France, 2006. [6] B. Wunderle, J. Kleff, D. May, M. Abo Ras, R. Schacht, H. Oppermann, J. Keller and B. Michel. In-situ measurement of various thin Bond-Line-Thickness Thermal Interface Materials with Correlation to Structural Features. Proc 14 th Therminic 2008, Rome, Sept 24-26 2008 [7] R. Kempers, P. Kolodner, A. Lyons and A.J. Robinson. Development Of A High-Accuracy Thermal Interface Material Tester. Proc. 10 th Itherm Conf. 2008. [8] A. Devos, J.-F. Robillard, R. Côte et P. Emery. High Laser-Wavelength Sensitivity of the Picosecond Ultrasonic Response in Transparent Thin Films, Physical Review B 74, 6, 064114, 2006 [9] R. J. Linderman, T. Brunschwiler, U. Kloter, H. Toy, B.Michel, Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces, Proc. 23st IEEE SEMI-THERM Symp., 2007, pp. 87-94. [10] D.F. Rae and P. Borgesen. Optimising the automated assembly process for filled polymer-based themal bondlines. APEX 2009. [11] B. Wunderle and B. Michel. Lifetime Modeling for Microsystems Integration – from Nano to Systems. J. of ©EDA Publishing/THERMINIC 2009 231 ISBN: 978-2-35500-010-2
7-9 October 2009, Leuven, Belgium Microsystem Technologies, Vol 15, No 6, pp 799.813, Juni 2009 [12] B. Wunderle, K.-F. Becker, R. Sinning, O. Wittler, R. Schacht, H. Walter, M. Schneider-Ramelow, K. Halser, N. Simper, B. Michel and H. Reichl. Thermo- Mechanical Reliability during Technology Development of Power Chip-on-Board Assemblies with Encapsulation. J. Microsystem Technologies, 2009, DOI :10.1007/s00542-009-0907-1 [13] Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials. ASTM Standard D-5470-06, Copyright ASTM International, Conshohocken, PA, 2007. [14] O. Wittler, H. Walter, R. Dudek, W. Faust, W. Jun and B. Michel. Deformation and Fatigue Behaviour of AuSn Interconnects. Proc. EPTC, 2006 [15] O. Wittler, R. Mroßko, S. Huber, A. Gollhardt and B. Michel. Characterisation and modelling of the nanoindentation experiment in Au layers. Proc. 10 th EuroSimE Conf. 2009. ©EDA Publishing/THERMINIC 2009 232 ISBN: 978-2-35500-010-2
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