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Online proceedings - EDA Publishing Association

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7-9 October 2009, Leuven, Belgium<br />

0.5<br />

0.4<br />

δNu =0.18(Re p /Re) 0.7<br />

(R 2 = 0.696)<br />

0.5<br />

δNu =0.18(Re p /Re) 0.7<br />

(R 2 = 0.696)<br />

0.2<br />

δNu<br />

0.3<br />

0.2<br />

δNu<br />

0.1<br />

0.02<br />

0.1<br />

0<br />

0<br />

0.05<br />

0 0.5 1 1.5 2 2.5 3<br />

Re p /Re<br />

Fig. 7. Dimensionless heat transfer enhancement for pulsating flow through<br />

the heat sink as a function of the ratio of pulsating to steady flow<br />

component Re p /Re. Markers indicate the entire set of measurements for 35 <<br />

Re p < 225. Solid line indicates correlation in Eq. (4).<br />

The enhancement factors collapse satisfactorily when<br />

plotted versus Re p /Re. Besides the ratio Re p /Re, other<br />

dimensionless quantities and combinations have been<br />

explored to better collapse the results, e.g. dimensionless<br />

stroke length or Womersley number Wo. However none<br />

seemed to outperform the ratio Re p /Re.<br />

Figure 7 shows the following power law correlation fitted<br />

to the entire set of experimental results for pulsating flow:<br />

0.7<br />

⎛Re p ⎞<br />

δ Nu = 0.18⎜ ⎟ (R 2 = 0.696) (4)<br />

⎝ Re ⎠<br />

The above expression provides an adequate fit which at least<br />

shows the existence of a trend, however does not seem<br />

accurate enough to use as a prediction.<br />

Moreover, when plotting the same results on a nonlinear<br />

scale as in Fig. 8, a significantly different behaviour<br />

becomes apparent for a low and high ratio of pulsating to<br />

steady flow. Within the investigated range (0.09 < Re p /Re <<br />

4.4) and for increasing pulsating flow magnitude, the<br />

enhancement is first slightly negative albeit only a few<br />

percent. In this regime, pulsating flow seems to decrease<br />

cooling performance in this heat sink. Beyond Re p /Re > 0.2,<br />

the enhancement is positive and increases with Re p /Re. Only<br />

in this region does the correlation in Eq. (4) predict the<br />

experimental results with an acceptable degree of accuracy.<br />

The negligible enhancement or even slight deterioration of<br />

heat transfer for small pulsation amplitudes (Re p /Re < 0.2)<br />

reminds of findings by other authors [8,9], although the<br />

present case with an actual heat sink geometry (including<br />

conjugate heat transfer, hydraulically and thermally<br />

developing laminar flow) is difficult to compare to the cases<br />

presented in the literature.<br />

0.02<br />

0.05<br />

0 0.05 0.2 0.5 1 2 3<br />

Re p /Re<br />

Fig. 8. Identical to Fig. 7, yet with nonlinear plot scaling to reveal different<br />

behaviour at low and high pulsation magnitude Re p /Re.<br />

IV. CONCLUSIONS<br />

This paper has shown the potential for overall heat transfer<br />

rate enhancement using pulsating flow in single-phase liquid<br />

flow heat sink, for use in microelectronics cooling.<br />

This initial study uses a single rectangular channel serving<br />

as a reference case for subsequent studies of pulsating flow<br />

in parallel microchannels.<br />

Further improvements to the pulsating flow generator<br />

should significantly narrow the uncertainty margins on the<br />

parameters e.g. stroke length and pulsating Reynolds number<br />

Re p . Nevertheless by limiting the actuation frequency in this<br />

study, the results are deemed sufficiently reliable.<br />

For the investigated range (50 < Re < 400, 35 < Re p < 225,<br />

2 < Wo < 17), an enhancement factor of up to 40% is<br />

observed with respect to steady flow heat transfer at the<br />

same steady flow component.<br />

The data show a consistent trend for heat transfer<br />

enhancement as a function of the ratio of the pulsating to<br />

steady flow component Re p /Re. For small pulsation<br />

amplitude (Re p /Re < 0.2) a negligible yet slightly negative<br />

enhancement is observed. For larger pulsation amplitudes<br />

(Re p /Re > 0.2), the heat transfer enhancement increases with<br />

Re p /Re and can be predicted (yet with limited accuracy) by<br />

the power law expression in Eq. (4).<br />

ACKNOWLEDGMENTS<br />

This work is sponsored by the Institute for the promotion<br />

of Innovation by Science and Technology in Flanders (IWT),<br />

project SBO 60830 “HyperCool-IT”, as well as travel<br />

funding by Research Foundation Flanders (FWO). The<br />

authors explicitly thank Dr. Suresh V. Garimella, Benjamin<br />

J. Jones and Tannaz Harirchian from Purdue University,<br />

West Lafayette, In. for helpful discussions on this topic.<br />

©<strong>EDA</strong> <strong>Publishing</strong>/THERMINIC 2009 166<br />

ISBN: 978-2-35500-010-2

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