Online proceedings - EDA Publishing Association
Online proceedings - EDA Publishing Association
Online proceedings - EDA Publishing Association
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7-9 October 2009, Leuven, Belgium<br />
0.5<br />
0.4<br />
δNu =0.18(Re p /Re) 0.7<br />
(R 2 = 0.696)<br />
0.5<br />
δNu =0.18(Re p /Re) 0.7<br />
(R 2 = 0.696)<br />
0.2<br />
δNu<br />
0.3<br />
0.2<br />
δNu<br />
0.1<br />
0.02<br />
0.1<br />
0<br />
0<br />
0.05<br />
0 0.5 1 1.5 2 2.5 3<br />
Re p /Re<br />
Fig. 7. Dimensionless heat transfer enhancement for pulsating flow through<br />
the heat sink as a function of the ratio of pulsating to steady flow<br />
component Re p /Re. Markers indicate the entire set of measurements for 35 <<br />
Re p < 225. Solid line indicates correlation in Eq. (4).<br />
The enhancement factors collapse satisfactorily when<br />
plotted versus Re p /Re. Besides the ratio Re p /Re, other<br />
dimensionless quantities and combinations have been<br />
explored to better collapse the results, e.g. dimensionless<br />
stroke length or Womersley number Wo. However none<br />
seemed to outperform the ratio Re p /Re.<br />
Figure 7 shows the following power law correlation fitted<br />
to the entire set of experimental results for pulsating flow:<br />
0.7<br />
⎛Re p ⎞<br />
δ Nu = 0.18⎜ ⎟ (R 2 = 0.696) (4)<br />
⎝ Re ⎠<br />
The above expression provides an adequate fit which at least<br />
shows the existence of a trend, however does not seem<br />
accurate enough to use as a prediction.<br />
Moreover, when plotting the same results on a nonlinear<br />
scale as in Fig. 8, a significantly different behaviour<br />
becomes apparent for a low and high ratio of pulsating to<br />
steady flow. Within the investigated range (0.09 < Re p /Re <<br />
4.4) and for increasing pulsating flow magnitude, the<br />
enhancement is first slightly negative albeit only a few<br />
percent. In this regime, pulsating flow seems to decrease<br />
cooling performance in this heat sink. Beyond Re p /Re > 0.2,<br />
the enhancement is positive and increases with Re p /Re. Only<br />
in this region does the correlation in Eq. (4) predict the<br />
experimental results with an acceptable degree of accuracy.<br />
The negligible enhancement or even slight deterioration of<br />
heat transfer for small pulsation amplitudes (Re p /Re < 0.2)<br />
reminds of findings by other authors [8,9], although the<br />
present case with an actual heat sink geometry (including<br />
conjugate heat transfer, hydraulically and thermally<br />
developing laminar flow) is difficult to compare to the cases<br />
presented in the literature.<br />
0.02<br />
0.05<br />
0 0.05 0.2 0.5 1 2 3<br />
Re p /Re<br />
Fig. 8. Identical to Fig. 7, yet with nonlinear plot scaling to reveal different<br />
behaviour at low and high pulsation magnitude Re p /Re.<br />
IV. CONCLUSIONS<br />
This paper has shown the potential for overall heat transfer<br />
rate enhancement using pulsating flow in single-phase liquid<br />
flow heat sink, for use in microelectronics cooling.<br />
This initial study uses a single rectangular channel serving<br />
as a reference case for subsequent studies of pulsating flow<br />
in parallel microchannels.<br />
Further improvements to the pulsating flow generator<br />
should significantly narrow the uncertainty margins on the<br />
parameters e.g. stroke length and pulsating Reynolds number<br />
Re p . Nevertheless by limiting the actuation frequency in this<br />
study, the results are deemed sufficiently reliable.<br />
For the investigated range (50 < Re < 400, 35 < Re p < 225,<br />
2 < Wo < 17), an enhancement factor of up to 40% is<br />
observed with respect to steady flow heat transfer at the<br />
same steady flow component.<br />
The data show a consistent trend for heat transfer<br />
enhancement as a function of the ratio of the pulsating to<br />
steady flow component Re p /Re. For small pulsation<br />
amplitude (Re p /Re < 0.2) a negligible yet slightly negative<br />
enhancement is observed. For larger pulsation amplitudes<br />
(Re p /Re > 0.2), the heat transfer enhancement increases with<br />
Re p /Re and can be predicted (yet with limited accuracy) by<br />
the power law expression in Eq. (4).<br />
ACKNOWLEDGMENTS<br />
This work is sponsored by the Institute for the promotion<br />
of Innovation by Science and Technology in Flanders (IWT),<br />
project SBO 60830 “HyperCool-IT”, as well as travel<br />
funding by Research Foundation Flanders (FWO). The<br />
authors explicitly thank Dr. Suresh V. Garimella, Benjamin<br />
J. Jones and Tannaz Harirchian from Purdue University,<br />
West Lafayette, In. for helpful discussions on this topic.<br />
©<strong>EDA</strong> <strong>Publishing</strong>/THERMINIC 2009 166<br />
ISBN: 978-2-35500-010-2