Online proceedings - EDA Publishing Association
Online proceedings - EDA Publishing Association
Online proceedings - EDA Publishing Association
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7-9 October 2009, Leuven, Belgium<br />
by the isolation oxide, nitride layers, anchor metal and<br />
IV. FEM METHODOLOGY & RESULTS<br />
nickel layers.<br />
To verify design concept and<br />
device parameters, device<br />
level FEM simulation methodology for the proposed<br />
microgyroscope is devised in this section.<br />
Thermoelectromechanical (TEM) analysis module of the<br />
MEMS Design software IntelliSuite has been used for this<br />
purpose.<br />
3D Builder is used to build and mesh the three-<br />
dimensional geometry of the<br />
MEMS structure before<br />
transferring to TEM module to assign material properties,<br />
loads and boundaries to fully<br />
analyze a device in the<br />
static, frequency and dynamic domain. Simpler and faster<br />
simulations like modal and static analyses were performed<br />
prior to lengthy dynamic simulations to understand the<br />
initial behavior of the device.<br />
A. Modal Analysis<br />
Fig. 3. Microgyroscope fabricated through MetalMUMPs process First of all modal analysis was carried out to predict the<br />
using L-Edit of MEMSPro.<br />
natural frequencies and their respective mode shape for<br />
the proposed microgyroscope. While calculating natural<br />
frequencies and associated mode shapes, a residual stress<br />
of 100 MPa has been incorporated with other<br />
thermophysical properties of nickel (Ni) for accurate<br />
results [9].<br />
Fig. 6, (a) and (b) show the respective drive and sense<br />
mode shape at 5.73 kHz and 5.02 kHz. A slight difference<br />
in the natural frequency of both drive and sense mode is<br />
intentionally made to achieve a larger bandwidth,<br />
compromising the drive displacement at resonance.<br />
(a)<br />
(b)<br />
Fig. 4. Cross sectional views of a microgyroscope (a) 3D view and<br />
(b) 2D view<br />
(a)<br />
Fig. 5. Process flow for the fabrication of microgyroscope using<br />
MetalMUMPs in MEMSPro (a) N-type silicon wafer (b) 2µm<br />
thick isolation oxide layer (c) patterning of Oxide<br />
1 layers (d) patterning<br />
of 0.7µm thick Polysilicon layer (e) patterning of<br />
anchor metal layer (f)<br />
patterning of 20µm electroplated structural layer of Ni and trench etch in<br />
the substrate.<br />
(b)<br />
Fig. 6. Modal analysis results (a) Drive mode at 5.37 kHz and (b)<br />
Sense mode at 5.02 kHz.<br />
©<strong>EDA</strong> <strong>Publishing</strong>/THERMINIC 2009 42<br />
ISBN: 978-2-35500-010-2