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TABLE VI COMPARISON OF RESULTS FOR FIXED FLOW VELOCITY OF 3 M/S Junction Temperatures (˚C) CTM Detailed Model Error % Laser Diode 24.5 24.8 1.3 TIA 122.6 123.7 0.9 Laser Driver 26.1 25.9 -0.9 Post Amp IC 32.8 32.4 -1.1 Heat Flow (W) Top 0.0733 0.0749 2.2 Bottom 0.3638 0.3567 -2.0 Left 0.0734 0.0756 2.9 Right 0.0303 0.0312 2.9 TABLE VII COMPARISON OF RESULTS FOR FIXED FLOW VELOCITY OF 4 M/S Junction Temperatures (˚C) CTM Detailed Model Error % Laser Diode 24.3 24.6 1.4 TIA 122.4 123.5 0.9 Laser Driver 25.9 25.7 -0.8 Post Amp IC 32.5 32.2 -1.1 Heat Flow (W) Top 0.0834 0.0848 1.6 Bottom 0.3445 0.3377 -2.0 Left 0.0777 0.0798 2.6 Right 0.0351 0.0363 3.1 7-9 October 2009, Leuven, Belgium of the current research. One of the limitations of the methodology is the trial and error method used for laying out the network topology. Although many different network topologies were experimented, the network topology suggested for the SFP CTM in the current work does not have to be the final best network possible. There can be any other types of network topologies, especially ones that have multiple internal nodes, which can provide better redirection of heat flow. The CTM is obtained through the optimization of the cost function. It was found that the CTM obtained was sensitive to initial start values of the resistors, the upper and lower bounds on the resistors and the error constraints. The authors realize that some of these limitations can be overcome using the commercial code DOTCOMP[23] which will be a subject for later study. VI. CONCLUSION The CTM for the SFP has been generated using the DELPHI Methodology. It has been validated up to the point of end-user usage, which is usage in CFD codes for thermal design and analysis in practical applications. The SFP CTM is validated in real-time situations such as natural convection, natural convection with heat sink fitted on the SFP and forced convection for different velocities. In all cases the SFP CTM predicted the junction temperature of all its four active components with relative error of less than 10%. The errors on the heat flows through the sides were also less than 10%. Thus, the SFP CTM can be used in detailed system-level models for accurate prediction with a large reduction in computational resources. V. ADVANTAGES AND LIMITATIONS OF GENERATING CTM FOR SFP BY DELPHI METHODOLOGY From the results, the DELPHI approach to generate CTMs for SFP has proved to be very successful. This study shows the obvious advantage of the DELPHI methodology – the CTM for the SFP can be readily implemented for thermal design and analysis of systems that use SFPs. Apart from this, the results have shown that CTMs can be generated for SFPs and SFP-like packages which have multiple-heat sources using the DELPHI methodology. Also, the methodology allows for better thermal characterization of the SFP package by identifying junction temperatures as an important quantity (as opposed to specifying case temperatures of SFPs). The DELPHI-type CTM for the SFP allows representation of the component using nine nodes instead of hundreds of thousands of grid cells greatly simplifying CFD-based computations to a matter of seconds than hours. This type of reduction also allows accurate analysis of system-level models that employ a huge number of SFPs. Also, the CTM generated by this method is highly portable; CTMs can be distributed in the form of library models in CFD-based software such as Icepak and Flotherm. Although there are significant advantages of the application of DELPHI methodology to generate CTM for the SFP, some limitations were identified during the course ACKNOWLEDGMENT The authors acknowledge the support of Electronic Cooling Solutions and the Desktop Switching Business Unit of Cisco Systems, California, for funding of this research. The authors are grateful for the support of David Meadowcroft and Ron Kaneshiro of Avago Technologies, California, for providing enthusiastic support of the overall research and more specifically with the experimental section. The authors also acknowledge the assistance of Dr. Sarang Shidore of Mentor Graphics in modeling the compact thermal model in Flotherm. REFERENCES [1] Small Form-factor Pluggable (SFP) Transceiver Multi-Source Agreement (MSA), “Cooperation Agreement for Small Form-Factor Pluggable Transceivers”, September 14, 2000. [2] Lasance, C., Vinke, H., Rosten, H., and Weiner, K.L., 1995, “A Novel Approach for the Thermal Characterization of Electronic Parts”, Proc. of SEMITHERM XI, San Jose, CA, pp. 1-9. [3] Rosten, H. I., Lasance, C. J. M., Parry, J.D., “The World of Thermal Characterization According to DELPHI—Part I: Background to DELPHI” IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 20, No. 4, December 1997. [4] Rosten, H. I., Lasance, C. J. M., Parry, J.D., “The World Of Thermal Characterization According To DELPHI—Part II: Experimental and Numerical Methods”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 20, No. 4, December 1997. [5] Lasance, C.J.M., “Special Section on Compact Thermal Modeling”, ©EDA Publishing/THERMINIC 2009 29 ISBN: 978-2-35500-010-2
7-9 October 2009, Leuven, Belgium IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, March 2003. [6] Lasance, C.J.M, ‘‘Recent Progress in Thermal Compact Modeling,’’ Proc. SEMITHERM XIX, March, San Jose, pp. 290–299, 2003. [7] Lasance, C.J.M, Foreword, THERMINIC Special Section, IEEE Transactions on Components and Packaging Technologies, Vol 28, No. 4, December 2005. [8] Lasance, C. J. M., 2008, “Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review”, Heat Transfer Engineering, Vol. 29, No.2, pp. 149-168. [9] Assouad, Y., Gatfosse, F., and Gautier, T., “Transient Characterization and Modeling of Ceramic Packages,” in Proc. 2nd THERMINIC Int. Workshop Thermal Investigations IC’s Microstruc., Budapest, September 1995. [10] Raghupathy, A. P., Aranyosi, A., Ghia, U., Ghia, K., and Maltz, W., “Development of Boundary-Condition-Independent Compact Thermal Models for Opto-Electronic Packages”, ASME Interpack, IPACK 2009-89092, San Fransico, CA, July 2009. [11] Sabry, M. N., 2007, “Flexible Profile Compact Thermal Models for Practical Geometries” Trans. of the ASME, pp.256-259 Vol. 129. [12] Bosch, E. G. T., “Thermal Compact Models: An Alternative Approach,” Proc. THERMINIC 7, Paris, France, pp. 191–196, Sept. 25–28, 2001. [13] Bosch, E., and Sabry, M. N., “Thermal Compact Models for Electronic Systems,” in Proc. SEMITHERM XVIII, pp. 21–29, 2002. [14] Sabry, M. N., “Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress,” Proceedings of IPACK03, International Electronic Packaging Technical Conference and Exhibition, Maui, HI, Interpack 2003-35185, 2003. [15] Sabry, M. N., “High-Precision Compact-Thermal Models”, IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 4, December 2005. [16] Sabry, M. N.,“Flexible Profile Compact Thermal Models for Practical Geometries” Transactions of the ASME, pp.256-259 Vol. 129, September 2007. [17] www.flomerics.com/products/flotherm [18] Matlab, User Manual, http://www.mathworks.com/ [19] Aranyosi, A., Ortega, A., Griffin, R., West, S., and Edwards, D., “Compact Thermal Models of Packages used in Conduction Cooled Applications,” IEEE Trans. Comp. Packag. Technol., vol. 23, p. 470, 2000. [20] Aranyosi, A., Ortega, A., Evans, J., Tarter, T., Pursel, J., Radhakrishnan, J, “Development of Compact Thermal Models for Advanced Electronic Packaging: Methodology and Experimental Validation for a Single-Chip CPGA Package”, IEEE Inter Society Conference on Thermal Phenomena, 2000 [21] Tomlab, User Manual, http://tomopt.com/ [22] http://www.conopt.com/ [23] Lasance, C.J.M., Hertog, D.D., and Stehouwer, P., “Creation and Evaluation of Compact Models for Thermal Characterization using Dedicated Optimization Software,” Proc. SEMITHERM XV, San Diego, CA, pp. 189–200, 1999. ©EDA Publishing/THERMINIC 2009 30 ISBN: 978-2-35500-010-2
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