27.01.2015 Views

Online proceedings - EDA Publishing Association

Online proceedings - EDA Publishing Association

Online proceedings - EDA Publishing Association

SHOW MORE
SHOW LESS

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

7-9 October 2009, Leuven, Belgium<br />

Optimal Channel Width Distribution of Single-Phase<br />

Microchannel Heat Sinks<br />

T. Van Oevelen 1 , F. Rogiers, M. Baelmans<br />

Katholieke Universiteit Leuven, Department of Mechanical Engineering,<br />

Celestijnenlaan 300A, bus 2421<br />

3001 Heverlee, Belgium<br />

Abstract: The channel width distribution of single-phase<br />

microchannel heat sinks is optimized based on 1D-modeling. Two<br />

objectives are regarded, i.e. minimal thermal resistance and<br />

minimal wall temperature gradient. The results differ significantly<br />

from the present status in literature due to a new parameterization.<br />

In addition the effects of axial conduction, fin width and pressure<br />

drop are investigated.<br />

Key words: microchannel, heat sink, optimal width distribution<br />

I. INTRODUCTION<br />

Single-phase microchannel heat sinks are considered as one<br />

of the most promising cooling technologies to cope with the<br />

increasing power densities in electronic chips. Hereby, a<br />

cooling fluid flows through a large set of very small, parallel<br />

channels in a heat sink mounted on the backside of the chip.<br />

This provides a high surface area density and a high<br />

convection heat transfer coefficient. As such, these systems<br />

are capable of cooling large power densities, while keeping<br />

the maximum chip temperature at an acceptable level.<br />

Since the early work of Tuckerman and Pease [12] a lot of<br />

optimization research has been conducted. Most authors used<br />

analytical methods to search for the optimal width and/or<br />

height of the microchannels ([3],[4],[5],[8],[11],[12]). Others<br />

applied numerical optimization methods for this task<br />

([2],[3],[9]), while some search for the optimum by scanning<br />

the parameter field ([6],[7]).<br />

Despite these efforts and the advantages of this cooling<br />

technique, an important drawback of microchannel heat sinks<br />

is still due to the fact that large temperature differences<br />

between inlet and outlet regions may occur. This is caused by<br />

a fluid temperature increase as it passes through the channels.<br />

This phenomenon induces temperature gradients in the heat<br />

sink and substrate, giving rise to thermal stresses.<br />

Furthermore, since the maximum temperature occurs only at<br />

the outlet of the channel, the substrate temperature in the<br />

upstream part of the channel is generally far below this<br />

maximum. As such, striving for higher wall temperatures in<br />

this upstream part close to its maximal value yields a larger<br />

effective temperature difference. This will facilitate heat<br />

transfer. Therefore not exploiting this potential can be<br />

considered as an unnecessary waste of performance.<br />

Bau [1] presented a solution to exploit this potential by<br />

introducing channels with a non-uniform cross-section. This<br />

allows the entire channel width distribution to be optimized,<br />

thereby increasing the number of degrees of freedom. It<br />

appears that a reduction of the thermal resistance by 5%<br />

compared to the uniform channels is possible. Also major<br />

reductions in temperature gradients are shown.<br />

The aim of this paper is to extend the analysis as presented<br />

by Bau by introducing a more accurate parameterization of<br />

the channel width distribution. This leads to a more detailed<br />

description of optimal channel width distributions. As<br />

objective, both minimal wall temperature gradient and<br />

minimal thermal resistance are investigated. For the latter<br />

objective, the effects of axial conduction are shown. Due to<br />

the large number of design parameters, optimization is based<br />

on numerical methods.<br />

In the next section, two thermal-hydraulic models are<br />

described: one with and one without axial conduction.<br />

Subsequently, the objective functions and parameterization<br />

are introduced. In section IV the optimization results are<br />

presented and discussed, together with a sensitivity analysis<br />

of fin width and pressure drop.<br />

II.<br />

MATHEMATICAL MODEL<br />

The physics model that is used in this paper is a onedimensional<br />

model, based upon integration of the flow and<br />

heat transfer equations with respect to the cross-section of the<br />

channels. A drawing of the channels cross-section is shown<br />

in Fig. 1. In a real heat sink, this element can be repeated as<br />

much as needed. The geometric variables of the cross-section<br />

are also depicted in Fig. 1. The length of the channels is<br />

denoted by L * . As a convention, dimensional variables are<br />

marked with a star ‘*’, while dimensionless variables are not.<br />

1 Corresponding author. Tel.: +32 16 322511; fax: +32 16 322985; email address: tijs.vanoevelen@mech.kuleuven.be<br />

This work is sponsored by the IWT, The Institute for the Promotion of Innovation by Science and Technology in Flanders, Belgium, through project SBO 60830,<br />

“HyperCool-IT”.<br />

©<strong>EDA</strong> <strong>Publishing</strong>/THERMINIC 2009 157<br />

ISBN: 978-2-35500-010-2

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!