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7-9 October 2009, Leuven, Belgium thermal PCB model ambient temperature electrical device and bulb models thermal device model Fig. 11: SPICE circuit, with electrical equivalent circuit of the PCB and the 4 channel eXtreme switch device Fig. 12: Temperature response for use case 1, high side switch HS2 ON ©EDA Publishing/THERMINIC 2009 127 ISBN: 978-2-35500-010-2
7-9 October 2009, Leuven, Belgium Fig. 13: Temperature response for use case 2, high side switches HS2 and HS1 sequentially switched ON Fig. 14: Temperature response for use case 2 with the thermally enhanced printed circuit board ©EDA Publishing/THERMINIC 2009 128 ISBN: 978-2-35500-010-2
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International Workshop on THERMal I
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7-9 October 2009, Leuven, Belgium
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Poster session: Introduction* 7-9 O
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7-9 October 7-9 October 2009, 2009,
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x −1 V(x) = , f(y) = x + 1 y + 1
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of 75 o C for fair comparison. Only
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II. GCS DESIGN AND FIELD TEST 7-9 O
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7-9 October 2009, Leuven, Belgium a
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External Nodes (ne) European projec
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G 2 (resp. C 2 , F 2 ) and G 2e (re
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TABLE I MODEL PARTS CHARACTERISTICS
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II. DEVELOPMENT OF CTM FOR SFP The
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OASIS files Final 2D layout design_
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Thermal behaviour causes some varia
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on devices of long-term storage at
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Fig. 3. Standard package simulation
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∂ 2 T ∂ x ∂2 T T 2 ∂ y 2
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The spray boiling curves obtained i
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along the measure zone over the hea
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III. TEMPERATURE AND THICKNESS DEPE
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an increasing function of its TE fi
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The regime transition at λ β = 1.
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onding it was compressed down to ~6
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