Online proceedings - EDA Publishing Association

More documents

Recommendations

Info

VI. NOMENCLATURE A nm unit cell area [m 2 ] c p specific heat capacity [J/(kg*K)] g coefficient [L/min/cm 2 ] h eff effective heat transfer coeff. [W/(m 2 *K)] h nm unit cell heat transfer coefficient [W/(m 2 *K)] HT heat transfer k coefficient [-] k v coefficient of flow [L/min] n number of cold plates [-] P cp cold plate pumping power [W] P system total system pumping power [W] total electrical processor power [W] P el Δp loop Δp cp Δp system dp/dx Q rack cooling loop pressure drop [bar] cold plate pressure drop [bar] system pressure drop = Δploop + Δpcp [bar] pressure gradient [Pa/m] heat flow [W] q nm unit cell heat flux [W/cm 2 ] R fluid fluid resistance [kg/(s*m 4 )] R conv convective thermal resistance [K*mm 2 /W] R TIM thermal interface resistance [K*mm 2 /W] T jmax maximal junction temperature [°C] T fout fluid outlet temperature [K] fluid inlet temperature [K] T fin ΔT fout-in ΔT j t nm t Si t TIM V fluid temp. difference from outlet to inlet [K] T jmax - T jmin [K] unit cell cavity height [mm] silicon die thickness [mm] bond-line thickness [mm] cold plate volumetric flow rate [L/min] V nm unit cell volumetric flow rate [L/min] V system rack cooling loop vol. flow rate [L/min] 7-9 October 2009, Leuven, Belgium Greek letters ρ density of water [kg/m 3 ] constants h 0 p 0 reference heat transfer coefficient = 1 W/(m 2 *K) reference pressure = 1bar subscript/superscript cp cold plate el electrical eff effective j junction fout-in fluid outlet minus inlet fin fluid inlet fout fluid outlet loop server rack cooling loop max maximal m cell number in y-direction n cell number in x-direction ACKNOWLEDGMENT We acknowledge Reto Wälchli, Urs Kloter, and Martin Witzig for their technical contributions and John Magerlein and Walter Riess for their continuous support. REFERENCES [1] J. Koomey, “Estimating Total Power Consumption by Servers in the U.S. and the World”, A report by the Lawrence Berkeley National Laboratory, February 2007, see http:// enterprise.amd.com/Downloads/svrpwrusecompletefinal.pdf. [2] E. Colgan et al., “A Practical Implementation of Silicon Microchannel Coolers for High Power Chips”, IEEE Transactions on Components and Packaging Technologies, Vol. 30 No. 2., June 2007, pp. 218-225. [3] T. Brunschwiler et al., “Towards Zero Emission Datacenters”, IBM J. RES. & DEV., vol. 53 NO. 3 PAPER 11, 2009, see http://www.research.ibm.com/journal/rd/533/brunschwiler.pdf [4] H. Hamann et al., “Spatially-Resolved Imaging of Microprocessor Power (SIMP): Hotspots in Microprocessors”, Proc. 10th Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronics Systems ITHERM 06, 30 May – 2 June, 2006, pp. 121-125. ©EDA Publishing/THERMINIC 2009 155 ISBN: 978-2-35500-010-2
[5] P. Lee and S. Garimella, “Hot-Spot Thermal Management with Flow Modulation in a Microchannel Heat Sink”, Proc. of IMECE2005 ASME, 5 – 11 November, 2005, Orlando, pp. 643- 647. 7-9 October 2009, Leuven, Belgium [6] T. Brunschwiler et al., “Hotspot-Optimized Interlayer Cooling in Vertically Integrated Packages”, Proc. MRS Fall Meeting 2008, 1 – 5 December, 2008, Orlando. [7] J. Valenzuela et al., “Cooling High Heat Flux Devices with Mikros”, Mikros Manufacturing Inc., White Paper, http://www.mikrostechnologies.com. [8] J. Schulz-Harder, “Efficient Cooling of Power Electronics”, PCIM Conference, Shanghai, 2006, pp. 208-212. [9] R. Wälchli et al., “Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design”, Int. Journal of Heat and Mass Transfer, in press. [10] T. Brunschwiler et al., “Direct Liquid-Jet Impingement Cooling with Micron-Sized Nozzle Array and Distributed Return Architecture”, Proc. ITHERM 2006, San Diego, CA, 196-203. ©EDA Publishing/THERMINIC 2009 156 ISBN: 978-2-35500-010-2
Page 1 and 2:
International Workshop on THERMal I
Page 3 and 4:
7-9 October 2009, Leuven, Belgium
Page 5 and 6:
Page 7 and 8:
Page 9 and 10:
Poster session: Introduction* 7-9 O
Page 11 and 12:
7-9 October 7-9 October 2009, 2009,
Page 13 and 14:
7-9 October 2009, Leuven, Belgium T
Page 15 and 16:
7-9 October 2009, Leuven, Belgium u
Page 17 and 18:
7-9 October 2009, Leuven, Belgium p
Page 19 and 20:
7-9 October 2009, Leuven, Belgium E
Page 21 and 22:
x −1 V(x) = , f(y) = x + 1 y + 1
Page 23 and 24:
of 75 o C for fair comparison. Only
Page 25 and 26:
II. GCS DESIGN AND FIELD TEST 7-9 O
Page 27 and 28:
7-9 October 2009, Leuven, Belgium a
Page 29 and 30:
External Nodes (ne) European projec
Page 31 and 32:
G 2 (resp. C 2 , F 2 ) and G 2e (re
Page 33 and 34:
TABLE I MODEL PARTS CHARACTERISTICS
Page 35 and 36:
II. DEVELOPMENT OF CTM FOR SFP The
Page 37 and 38:
7-9 October 2009, Leuven, Belgium r
Page 39 and 40:
Page 41 and 42:
7-9 October 2009, Leuven, Belgium I
Page 43 and 44:
7-9 October 2009, Leuven, Belgium u
Page 45 and 46:
7-9 October 2009, Leuven, Belgium s
Page 47 and 48:
7-9 October 2009, Leuven, Belgium N
Page 49 and 50:
Page 51 and 52:
7-9 October 2009, Leuven, Belgium D
Page 53 and 54:
7-9 October 2009, Leuven, Belgium b
Page 55 and 56:
7-9 October 2009, Leuven, Belgium C
Page 57 and 58:
OASIS files Final 2D layout design_
Page 59 and 60:
7-9 October 2009, Leuven, Belgium B
Page 61 and 62:
Page 63 and 64:
7-9 October 2009, Leuven, Belgium 3
Page 65 and 66:
7-9 October 2009, Leuven, Belgium b
Page 67 and 68:
Page 69 and 70:
7-9 October 2009, Leuven, Belgium F
Page 71 and 72:
Page 73 and 74:
Thermal behaviour causes some varia
Page 75 and 76:
on devices of long-term storage at
Page 77 and 78:
Page 79 and 80:
Fig. 3. Standard package simulation
Page 81 and 82:
Page 83 and 84:
∂ 2 T ∂ x ∂2 T T 2 ∂ y 2
Page 85 and 86:
Page 87 and 88:
q h T h 7-9 October 2009, Leuven, B
Page 89 and 90:
Page 91 and 92:
7-9 October 2009, Leuven, Belgium P
Page 93 and 94:
Page 95 and 96:
Page 97 and 98:
7-9 October 2009, Leuven, Belgium c
Page 99 and 100:
is used to model the forward polari
Page 101 and 102:
7-9 October 2009, Leuven, Belgium I
Page 103 and 104:
Page 105 and 106:
III. SUMMARY In this study it was s
Page 107 and 108:
where V is open-circuit voltage, r
Page 109 and 110:
V. THERMAL MATCHING IN LOW-DIMENSIO
Page 111 and 112:
Fig. 8. Low-power wireless medical
Page 113 and 114:
Page 115 and 116: 7-9 October 2009, Leuven, Belgium F
Page 117 and 118: 7-9 October 2009, Leuven, Belgium C
Page 119 and 120: 7-9 October 2009, Leuven, Belgium
Page 123 and 124: 7-9 October 2009, Leuven, Belgium [
Page 125 and 126: 7-9 October 2009, Leuven, Belgium R
Page 127 and 128: III. FINITE ELEMENT MODELLING OF BG
Page 129 and 130: 7-9 October 2009, Leuven, Belgium I
Page 131 and 132: 7-9 October 2009, Leuven, Belgium V
Page 133 and 134: I OLED 7-9 October 2009, Leuven, Be
Page 135 and 136: 7-9 October 2009, Leuven, Belgium E
Page 137 and 138: 7-9 October 2009, Leuven, Belgium T
Page 141 and 142: 7-9 October 2009, Leuven, Belgium P
Page 143 and 144: 7-9 October 2009, Leuven, Belgium r
Page 145 and 146: Fig. 5 Computed absolute temperatur
Page 151 and 152: 7-9 October 2009, Leuven, Belgium C
Page 153 and 154: ETF ∫ VCO f vco (T) output 7-9 Oc
Page 155 and 156: 7-9 October 2009, Leuven, Belgium H
Page 157 and 158: profile describes the temperature v
Page 159 and 160: In Fig. 9 (a) the same integer work
Page 165: meshes with highest heat removal ra
Page 171 and 172: 7-9 October 2009, Leuven, Belgium o
Page 173 and 174: In contrast to earlier results pres
Page 175 and 176: 7-9 October 2009, Leuven, Belgium (
Page 177 and 178: 7-9 October 2009, Leuven, Belgium 0
Page 181 and 182: hosing fittings etc.) were ‘off t
Page 185 and 186: ©EDA Publishing/THERMINIC 2009 174
Page 193 and 194: The spray boiling curves obtained i
Page 195 and 196: along the measure zone over the hea
Page 199 and 200: 7-9 October 2009, Leuven, Belgium f
Page 201 and 202: 7-9 October 2009, Leuven, Belgium t
Page 205 and 206: 7-9 October 2009, Leuven, Belgium a
Page 207 and 208: III. TEMPERATURE AND THICKNESS DEPE
Page 209 and 210: 7-9 October 2009, Leuven, Belgium d
Page 211 and 212: 7-9 October 2009, Leuven, Belgium s
Page 213 and 214: 7-9 October 2009, Leuven, Belgium h
Page 215 and 216: an increasing function of its TE fi
Page 217 and 218:
7-9 October 2009, Leuven, Belgium (
Page 219 and 220:
The regime transition at λ β = 1.
Page 221 and 222:
Page 223 and 224:
Page 225 and 226:
7-9 October 2009, Leuven, Belgium k
Page 227 and 228:
Page 229 and 230:
7-9 October 2009, Leuven, Belgium r
Page 231 and 232:
transient is measured by the transi
Page 233 and 234:
Page 235 and 236:
7-9 October 2009, Leuven, Belgium P
Page 237 and 238:
Page 239 and 240:
Page 241 and 242:
onding it was compressed down to ~6
Page 243 and 244:
7-9 October 2009, Leuven, Belgium M
Page 245:
7-9 October 7-9 October 2009, 2009,
show all

Online proceedings - EDA Publishing Association

Create successful ePaper yourself

Delete template?

Save as template?