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Online proceedings - EDA Publishing Association

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7-9 October 2009, Leuven, Belgium<br />

Directional Thermal Conductivity of a Thin Si Suspended<br />

Membrane with Stretched Ge Quantum Dots<br />

Jean-Numa Gillet, ∗ Bahram Djafari-Rouhani, Yan Pennec<br />

Université de Lille 1, Institut d'Electronique de Microélectronique et de Nanotechnologie (IEMN, CNRS UMR 8520),<br />

Département de Physique, Av. Poincaré, BP 60069, 59652 Villeneuve d'Ascq cedex, France (www.iemn.univ-lille1.fr);<br />

Members of the European Consortium NANOPACK<br />

Abstract-We model a nanomaterial showing a hybrid<br />

thermal behavior between dissipative and insulating<br />

regimes. The nanomaterial is made up of a thin Si<br />

suspended membrane covered by self-assembled Ge<br />

quantum dots (QDs) with facets. A membrane plane is<br />

constituted from the orthogonal [100] and [001]<br />

directions (x and z, respectively). The QDs are stretched<br />

in [001] forming nanoscale phonon waveguides. When<br />

hot and cold junctions are connected to the membrane<br />

following [001], the throughput thermal conductivity λ<br />

shows a significant exaltation with respect to the in-plane<br />

orthogonal direction [001] where QD constriction is<br />

defined. This property can be used for the design of<br />

nanoscale dissipaters to remove heat in only one main<br />

direction. Indeed, low leakage heat currents are<br />

obtained in other directions so that they cannot affect<br />

thermal budget in other parts of a device to cool as a<br />

silicon chip. In our theoretical model, a deflection angle<br />

β is taken in a membrane plane from the axis x. The<br />

anisotropic thermal conductivity is analyzed as a<br />

function of β. In an example molecular-scale device, λ<br />

can be exalted by 4 to 5 folds, or from 0.7 to 2.9 W/m/K,<br />

when β is increased from 0° (x) to 90° (z), respectively.<br />

Therefore, the QD-waveguide nanomaterial presents a<br />

different thermal insulating behavior in the direction<br />

[100] and can as well be used for the design of both<br />

dissipative and thermoelectric devices. The transition<br />

between both contra effects is obtained for the in-plane<br />

close-packed directions .<br />

Keywords: Heat dissipation, Thermoelectrics, Nanoscale<br />

devices, Quantum dots, Silicon, Germanium<br />

I. INTRODUCTION<br />

The design of nanostructured semiconducting<br />

devices with optimized thermal properties and indirect<br />

electronic band gap (as those using the Si/Ge IV-IV<br />

∗ Corresponding author’s email: jean-numa.gillet@univ-lille1.fr<br />

couple) is currently one of the major challenges for onchip<br />

cooling in nanoscale silicon-based architectures [1].<br />

These thermal nanodevices should enable continuation of<br />

the historical integration pace given by the Moore's law<br />

in CMOS microelectronics.<br />

With the fast and spectacular development of<br />

nanotechnology, self-assembly became a major<br />

technology for bottom-up fabrication of threedimensional<br />

(3D) nanostructured devices for various<br />

applications in drug design, biotechnologies, electronics<br />

and photonics, for instance [2-5]. Epitaxial self-assembly<br />

has been used to design germanium quantum-dot (QD)<br />

arrays in silicon [6,7]. The Ge QDs stand on or are<br />

sandwiched between diamond-cubic (dc) Si thin layers.<br />

In the classical Stranski-Krastanov growth mode, a thin<br />

wetting Ge layer is grown by epitaxy in the vertical<br />

direction with respect to a Si {010} substrate as<br />

investigated by experimentalists to fabricate twodimensional<br />

(2D) arrays of self-assembled (SA) Ge<br />

islands forming QDs with facets on Si. 3D ordering of a<br />

SA Ge-QD array in a Si matrix can be obtained,<br />

thereafter, by propagation of the stress field from a<br />

bottom layer to the superposed layers. To obtain sharper<br />

Ge QDs with lower size dispersion, more sophisticated<br />

technologies as e-beam and focus ion beam can be used.<br />

3D QD Ge/Si nanocomposites were used for quantum<br />

applications (as single-electron or single-photon devices,<br />

e.g.) and for solar-energy conversion.<br />

Gillet et al. recently presented theoretical studies of<br />

3D SA Ge-QD supercrystals in Si for the design of<br />

crystalline thermoelectric (TE) devices that can be<br />

CMOS-compatible [8,9]. These Si/Ge supercrystals can<br />

present an extreme reduction of the thermal conductivity<br />

λ that can be lower than only 0.04 W/m/K (i.e. less than<br />

twice the value of air) for different size parameters and<br />

Ge concentrations [9,10]. The aim of modeling this 3D<br />

Si/Ge supercrystal was to obtain λ as tiny as possible<br />

since the energy-conversion efficiency of a TE material is<br />

©<strong>EDA</strong> <strong>Publishing</strong>/THERMINIC 2009 203<br />

ISBN: 978-2-35500-010-2

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