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negligible. 7-9 October 2009, Leuven, Belgium detailed model is simulated first by keeping the SFP CTM deactivated. The junction temperature of the components and the heat flow through the sides are noted. The detailed model is deactivated now and the SFP CTM is activated. The results are recorded, and compared in Table 2. The table shows that the maximum error occurs in the junction temperature which is about 1.5 % deviant from the results predicted by the detailed model. TABLE II COMPARISON OF RESULTS PREDICTED BY SFP CTM AND SFP DETAILED MODEL FOR SIMULATION OF NATURAL CONVECTION WITH SFP HEATSINK (a) Detailed SFP Model (a) SFP CTM Fig. 12 Comparison of Flow Fields Predicted by the Detailed and Compact Models for Simulation of Natural Convection Junction Temperatures (˚C) CTM Detailed Model Error % Laser Diode 29.9 30.3 1.1 TIA 128.1 129.1 0.8 Laser Driver 31.6 31.4 -0.4 Post Amp IC 38.2 37.9 -0.8 Heat Flow (W) Top 0.1080 0.1084 0.4 Bottom 0.4000 0.3998 -0.1 Left 0.0212 0.0214 1.3 Right 0.0102 0.0101 -0.7 For this case, the flow and temperature fields are compared at a plane passing through the middle of the heatsink. The location of the plane is shown in Fig.14 Plane Fig. 14 Plane at which the Flow and Temperature Fields are analyzed for SFP with Heatsink (a) Detailed SFP Model Figs. 15a and b compare the flow fields on the plane passing through the middle of the SFP heatsink. The figures show that the detailed model predicts a slightly higher maximum velocity (0.132 m/s) than the maximum velocity predicted by the compact model (0.127 m/s). The error is about 4%. Figs.16a and b compare the temperature fields on the same plane for the detailed and compact SFP models. There is a maximum of 1% relative error seen in the temperature field predicted by the SFP CTM. (b) SFP CTM Fig. 13 Comparison of Temperature Fields Predicted by the Detailed and Compact Models for Simulation of Natural Convection B. Case 2- Natural Convection with Heat Sink In this case, the SFP was fitted with a heatsink on its top surface. This increases the heat flow through the top. The (a) Detailed SFP Model ©EDA Publishing/THERMINIC 2009 27 ISBN: 978-2-35500-010-2
7-9 October 2009, Leuven, Belgium and compact model for velocities of 0.5, 1, 2, 3 and 4 m/s respectively. In Table 3, the maximum error of 6.3% occurs on the heat flow prediction only when the SFP model is exposed to a low forced convection environment of 0.5 m/s. In all other cases, the maximum error is less than 4% on the heat flow prediction. The junction temperatures are predicted with errors less than 2%. Detailed analysis of flow and temperature fields is not necessary as small variations in temperature do not change the flow field prediction in forced convection environments. (b) SFP CTM Fig. 15 Comparison of Flow Fields Predicted by the Detailed and Compact Models for Simulation of Natural Convection with SFP Heatsink TABLE III COMPARISON OF RESULTS FOR FIXED FLOW VELOCITY OF 0.5 M/S Junction Temperatures (˚C) CTM Detailed Model Error % Laser Diode 26.7 27.1 1.5 TIA 124.8 126.0 0.9 Laser Driver 28.3 28.2 -0.5 Post Amp IC 35.0 34.7 -0.8 Heat Flow (W) Top 0.0560 0.0568 1.4 Bottom 0.4232 0.4182 -1.2 Left 0.0469 0.0485 3.2 Right 0.0145 0.0137 -6.3 (a) Detailed SFP Model (b) SFP CTM Fig. 16 Comparison of Temperature Fields Predicted by the Detailed and Compact Models for Simulation of Natural Convection with SFP Heat Sink TABLE IV COMPARISON OF RESULTS FOR FIXED FLOW VELOCITY OF 1 M/S Junction Temperatures (˚C) CTM Detailed Model Error % Laser Diode 25.7 26.0 1.3 TIA 123.8 124.9 0.9 Laser Driver 27.3 27.1 -0.7 Post Amp IC 33.95 33.7 -0.7 Heat Flow (W) Top 0.0579 0.0589 1.7 Bottom 0.4085 0.4027 -1.4 Left 0.0560 0.0581 3.7 Right 0.0183 0.0182 -0.6 C. Case 3- Forced Convection The detailed SFP model is now placed inside the duct with a fixed flow inlet. Flow inlet velocities of 0.5, 1, 2, 3 and 4 m/s are simulated and the data is recorded. After replacing the detailed model with the SFP CTM, the flow is simulated for the four velocities. The data between the SFP CTM and the detailed model is tabulated for each flow velocity. The flow pattern causes impingement on the left face of the SFP, recirculation on the right face of the SFP, and separating flow over the top face of the SFP. The convective heat transfer coefficient varies considerably from one point to another point on the surface of the SFP on all sides. Tables 3 through 7 show the comparison of the junction temperature and heat flow predicted by the detailed TABLE V COMPARISON OF RESULTS FOR FIXED FLOW VELOCITY OF 2 M/S Junction Temperatures (˚C) CTM Detailed Model Error % Laser Diode 24.9 25.2 1.3 TIA 123.0 124.1 0.9 Laser Driver 26.5 26.3 -0.8 Post Amp IC 33.2 32.8 -1.1 Heat Flow (W) Top 0.0664 0.0677 2.0 Bottom 0.3829 0.3763 -1.8 Left 0.0672 0.0695 3.3 Right 0.0243 0.0248 1.9 ©EDA Publishing/THERMINIC 2009 28 ISBN: 978-2-35500-010-2
Page 1 and 2: International Workshop on THERMal I
Page 3 and 4: 7-9 October 2009, Leuven, Belgium
Page 9 and 10: Poster session: Introduction* 7-9 O
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III. SUMMARY In this study it was s
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where V is open-circuit voltage, r
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V. THERMAL MATCHING IN LOW-DIMENSIO
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Fig. 8. Low-power wireless medical
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I OLED 7-9 October 2009, Leuven, Be
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ETF ∫ VCO f vco (T) output 7-9 Oc
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profile describes the temperature v
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In Fig. 9 (a) the same integer work
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meshes with highest heat removal ra
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[5] P. Lee and S. Garimella, “Hot
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In contrast to earlier results pres
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hosing fittings etc.) were ‘off t
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an increasing function of its TE fi
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