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temperature field from channel to channel are visible in Fig. 6 as well as in comparison with the results of Fig. 4. For a closer inspection of the effects of altering the power distribution, the temperature profiles along cuts B-B in Fig. 4 and C-C in Fig. 6 are compared in the upper part of Fig. 7. The percent difference plotted in the lower half of the figure shows that two channels experience a net increase in temperature while another two experience a net decrease. At first, one might expect that the magnitude of the change in the temperature should correspond to that of the power, but heat dissipation is three-dimensional and as the temperature rises in one channel, the increased local heat flux tends to raise the temperature of the adjacent channels. The threedimensional nature of the heat diffusion is evident, for example, by the widening of the temperature curves of the second and third channel. C. Conclusions Experimental methods are important and necessary means for obtaining temperature fields. Computational methods are also important and can play a key role in thermal characterization, particularly in prototyping and design. As demonstrated in this work, novel simulation methods can provide temperature information in three spatial dimensions and in critical regions that are inaccessible to measurement tools. By combining the complementary tools of simulation and experimentation, one can leverage their respective strengths and create a coupled approach that is vastly more powerful than either tool alone. 7-9 October 2009, Leuven, Belgium REFERENCES [1] P. E. Raad, J. S. Wilson, and D. C. Price, “System and Method for Predicting the Behavior of a Component,” U.S. Patent No. 6,064,810 (2000), Korean Patent No. 0501053 (2005), Japanese Patent No. 3,841,833 (2006). [2] J. S. Wilson and P. E. Raad, “A Transient Self-Adaptive Technique for Modeling Thermal Problems with Large Variations in Physical Scales,” International Journal of Heat and Mass Transfer, Vol. 47, pp. 3707-3720, 2004. [3] P. L. Komarov, M. G. Burzo, and P. E. Raad, “A Thermoreflectance Thermography System for Measuring the Transient Surface Temperature Field of Activated Electronic Device,” Proceedings to the 22nd Semiconductor Thermal Measurement, Modeling, and Management Symposium (SEMITHERM), Dallas, Texas, March 14- 16, 2006. [4] P. E. Raad, P. L. Komarov, and M. G. Burzo, “Non-Contact Surface Temperature Measurements Coupled with Ultrafast Real-Time Computation,” Proc. Proceedings to the 23rd Semiconductor Thermal Measurement, Modeling, and Management Symposium (SEMITHERM), San Jose, CA (2007) pp. 57-63. [5] P. E. Raad, P. L. Komarov, and M. G. Burzo, “Thermal Characterization of Embedded Electronic Features by an Integrated System of CCD Thermography and Self-Adaptive Numerical Modeling,” Microelectronics Journal, v. 39, pp. 1008-1015, 2008. [6] J.-H. Park, X. Wang, A. Shakouri, and S.-M. Kang, “Fast Computation of Temperature Profiles of VLSI ICs with High Spatial Resolution,” Proceedings to the 24th Semiconductor Thermal Measurement, Modeling, and Management Symposium (SEMITHERM), San Jose, CA, pp. 50-54, 2008 [7] P. E. Raad, P. L. Komarov, and M. G. Burzo, “Numerical Simulation of Complex Submicron Devices,” Electronics Cooling, Vol. 15, pp. 18-22, May 2009. [8] M.G. Burzo, P. L. Komarov, and P. E. Raad, “Thermal Transport Properties of Gold-Covered Thin-Film Silicon Dioxide,” IEEE Transactions on Components and Packaging Technologies, Vol. 26, pp. 80-88, 2003. [9] P. E. Raad, “Thermography Measurement System for Conducting Thermal Characterization of Integrated Circuits,” U.S. Patent No. 7,444,260 (2008) ©EDA Publishing/THERMINIC 2009 39 ISBN: 978-2-35500-010-2
7-9 October 2009, Leuven, Belgium Design Modeling and Simulation of Electrothermally Actuated Microgyroscope Fabricated using the MetalMUMPs. Rana I. Shakoor *† , Shafaat A. Bazaz, ** and M. M. Hasan * * Pakistan Institute of Engineering and Applied Sciences, Islamabad, Pakistan. ** Institute of Engineering and Applied Sciences, Topi, Swabi, NWFP, Pakistan. † Corresponding author, iqtidar@pieas.edu.pk, Tel: +92 333 5193862 Abstract— This paper presents a thermally actuated resonant microgyroscope fabricated using commercially available standard MEMS process MetalMUMPs. Chevronshaped thermal actuator is being used to drive the proof mass whereas sensing mechanism of the proposed device is based on the parallel plate sensing electrodes. The proposed model consists of three proof masses coupled with each other to be driven in through a frame. To achieve larger bandwidth and increased sensitivity, the proposed model of microgyroscope is operated with a slight mismatch in the resonant frequency. The resonant frequencies of microgyroscope are predicted to be 5.37 kHz for drive mode and 5.02 kHz for sensing mode. Finite element simulations are carried out to predict the performance of the proposed device using the thermo-physical properties of electroplated nickel. A brief theoretical description, dynamics and mechanical design considerations of the proposed gyroscopes model are also discussed. Prototype fabrication using MetalMUMPs has also been investigated in this study. Static simulation predicted a high drive displacement of 4.88 µm at 0.1V dc whereas dynamic transient simulations predicted a displacement of 0.28 µm when a sinusoidal voltage of 0.1V is applied. The proposed device has a size of 1.8 x 2.0 mm 2 with an estimated power consumption of 0.26 Watts. Keywords: Finite element method, Micromachined Gyroscope, MEMS, thermal V shaped actuator, Chevron shaped actuator I. INTRODUCTION Small size, high force, large displacement and low voltage consumption are the primary concerns for the development of MEMS based gyroscopes. Electrostatic, piezoelectric and electromagnetic are the common driving mechanisms used for the actuation of gyroscope proof mass. Most popular among them is the electrostatic actuation using comb drive actuators [1-2]. But these electrostatic actuators have typically small deflections thus require either close fabrication tolerances or high voltages to achieve large deflections. During last couple of years extensive research has been carried out on actuators using thermal expansion effects [3-4] activated by Joule heating. These thermal actuators can provide a large force and actuation both in parallel and perpendicular to the substrate and maybe fabricated using surface-micromachining technology that is compatible with IC technology. Two types of thermal actuators are very common: hot/cold arm thermal actuators and ‘V’ or ‘Chevron’ shaped actuators. In this paper we presented a novel Nickel based resonant micromachined vibratory gyroscope which utilizes Chevron shaped thermal actuator for driving the vibrating proof mass of the gyroscope in the primary drive mode. The main motivation to use a Chevron shaped thermal actuator instead of a conventional electrostatic actuator is its distinctiveness in terms of high force generation combined with the large displacements at a low excitation voltage [4]. Furthermore, such actuators may enable higher quality factor compared to the comb drive actuators, as it reduce the damping significantly and enhancing the use of such chevron based gyroscopes at atmospheric pressure. The electroplated Nickel was used as the structural layer for this Chevron based microgyroscope as the metals are much better for such heat actuators as they provide a relatively large deflection and force for low operating temperatures and power consumption. The lateral deflection of the heat actuators made from Ni metal is about ~ 60% larger than that of the Si based actuators under the same power consumption [5]. The simulated results presented in this study predict that Chevron shaped actuators made from metal may have very promising characteristics for the drive mode actuation of microgyroscopes. After introduction, this paper will cover the brief theory of operation of the thermally actuated chevron based microgyroscope. Section II describes the mechanical structure design of the device including its suspension design implementation. Section III comprehends a detailed implementation of low cost commercially available MetalMUMPs process for the fabrication of device along with prototype modeling of the device. In section IV, an FEM based systematic sequential thermoelectromechanical analyses methodology for the proposed gyroscope using the MEMS design software IntelliSuite is described. This section also presents the simulation results for modal, static and dynamic transient analyses of proposed microgyroscope. II. MICROGYROSCOPE STRUCTURE Fig. 1, shows a simplified three dimensional model of the proposed microgyroscope. The proposed model consists of three proof masses m 1, m 2 and m 3 which are ©EDA Publishing/THERMINIC 2009 40 ISBN: 978-2-35500-010-2
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