Superconducting Technology Assessment - nitrd

Process stability is key to the success of a project of this scale. In contrast to typical practice in R&D superconductive
IC chip fabrication, the fabrication process on the manufacturing line should not be modified once it is established.
In general, practices of the semiconductor industry should be adopted, including:
■ State of the art facilities (e.g., class 1-10 clean room)
– Size and build adequate clean room floor space.
■ Standard production tools
– Standardize on 200 mm wafers.
– Additional process tools as needed to meet demand Deep-UV stepper Facilities to support
CMP production tools (both oxide and metal CMP maybe required).
– Automated process tools wherever possible.
– Minimal handling of wafers by human operators.
■ Statistical process control and electronic lot travelers and tracking.
■ Assemble an experienced fab team, with perhaps 75% of personnel from the semiconductor
industry and 25% with extensive superconductor experience.
Semiconductor industry experience indicates that initial IC chip yields will be low (