Superconducting Technology Assessment - nitrd

■ Find a vendor willing to customize its advanced MCM packaging process to include superconducting
wire layers, and procure packages from the vendor. Because of the relatively low volumes in the
production phase, the RSFQ development effort would have to provide most—if not all—of the NRE
associated with this packaging. Smaller vendors would be more likely to support this than larger ones.
■ Procure MCMs with advanced normal metal layers for the bulk of the MCM, then develop an internal
process for adding superconducting wiring. This is less expensive than the first approach, but it depends
on development of a process on vendor material, which may change without notices, so it affords us less
assured access.
Additional important issues for manufacturability are:
■ Minimizing parts count.
■ System modularity (which allows individual chips or boards
to be easily assembled and replaced).
6.1.5 MULTI-CHIP MODULES AND BOARDS – ROADMAP AND FUNDING
A roadmap for the development of MCMs with SCE chips is shown below. The funding profile needed to maintain
development pace is listed in Table 6-2. The funding includes the establishment of a small superconducting MCM
production capability. More details are presented in Appendix L: Multi-Chip Modules and Boards. (The full text of
this appendix can be found on the CD accompanying this report.)
I. MCM
trade -
offs
1.
MCM
Req
docu
ment
3.MCM Test
Vehicle Design
2. MCM Process Development
5. MCM Test Vehicle
Fabrication and Qual
4. MCM Foundry Fabrication and Qual
2.
MCM Test
Vehicle
50 chips
25 Gbps
3.
MCM
Process
and
Foundry
qualified
7. Prototype
MCM Design
8. Prototype
MCM Fab and
Test
4.
MCM
Prototype
50 chips
50 Gbps
MILESTONES
5.
MCM
Prototype
qualified
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