Superconducting Technology Assessment - nitrd

6.1.3 MULTI-CHIP MODULES AND BOARDS – PROJECTIONS
The technology projections for MCMs and PCBs are given in Table 6-1:
6.1.4 MULTI-CHIP MODULES AND BOARDS – ISSUES AND CONCERNS
The panel expects that the technology will be available for such packaging, but the major issue to be addressed
will be assuring a source of affordable packaging. Several approaches should be evaluated:
116
MCM
Pad size (µm)
Pad pitch (µm)
Pad density (cm -2 )
Max. no. Nb layers
Max. no. W layers
Linewidth (µm)
Bandwidth (Gbps/wire)
Chip-to-chip SFQ
Chips per MCM
BACKPLANE
Technology
Size (cm 2 )
Bandwidth (Gbps/wire)
TABLE 6-1. TECHNOLOGY PROJECTIONS FOR MCMs AND PCBs
Year
2001 2005 2007 2009
■ Develop a superconducting MCM production capability, similar to the chip production capability
(perhaps even sited with the chip facility to share facility and some staff costs). This is the most
expensive approach, though perhaps the one that provides the most assured access.
75
125
2000
7
30
3
20
Yes
50
Ceramic
30
5
25
75
4000
9
40
3
30
Yes
50
Ceramic/
Flex
50
10
15
30
6000
9
40
2
40
Yes
50-150
Flex
100
25
15
30
6000
9
40
2
40
Yes
50-150
Flex
100
50