Superconducting Technology Assessment - nitrd

APPENDIX J: CAD
Figure 1: Circuit design and verification 203
Figure 2: Schematic view 204
Figure 3: Symbol view 205
Figure 4: VHDL view 206
Figure 5: Physical layout view 207
Figure 6: LMeter is specialized software that extracts the inductance value 208
of an interconnect from the physical layout
Figure 7: VHDL simulation performed on a large, mixed signal superconductor circuit 209
Figure 8: Layout-versus-Schematic verification on the chip level for a large chip 210
Figure 9: First-pass success is routine for circuits of up to a few thousand JJs 211
APPENDIX K: DATA SIGNAL TRANSMISSION
Figure 1: Channel loss for 50 cm electrical link 214
Figure 2: Long path data signal transmission requirements for one proposes petaflop architecture 215
Figure 3: Four channel transceiver arrays produced by the IBM/Agilent effort funded by DARPA 216
Figure 4: A 64-fiber, 4-wavelength, 25-Gbps CWDM system for bidirectional transmission 220
totaling 6.4 Tbps between a superconductive processor at 4 K and high speed mass
memory at 300K
Figure 5: A 3-fiber, 64-wavelength, 50-Gbps DWDM system for bidirectional transmission 221
totaling 6.4 Tbps between a superconductive processor at 4 K and high speed mass
memory at 300K
APPENDIX L: MULTI-CHIP MODULES AND BOARDS
Figure 1: Packaging concept for HTMT SCP 227
Figure 2: A multi-chip module with SCE chips 228
Figure 3: Lead inductance vs. bond length or height for different attach techniques 229
Figure 4: Heterogeneous stacking technology for system-in-stack 232
Figure 5: Stacks containing superconducting electronics circuits were cycled 232
from RT to 4 K several times
Figure 6: A prototype cryo enclosure for operation at 4 K 233
Figure 7: A typical cryocooler enclosure designed for communication applications 234
Figure 8: A rack mounted cryocooler enclosure example 234
Figure 8: Northrop Grumman’s high-efficiency cryocooler unit 236
Figure 9: Refrigerator efficiency of various cooling systems 237
Figure 10: Concept for a large-scale system including cryogenic 237
cooling unit for supercomputers
Figure 11: The cost of various refrigerators as a function of refrigeration 239
Figure 12: A high-speed flexible ribbon cable designed for modular attachment 240