Xilinx Reliability Monitor Report - Quarter 4 CY 2001
Xilinx Reliability Monitor Report - Quarter 4 CY 2001
Xilinx Reliability Monitor Report - Quarter 4 CY 2001
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Combined Lots:<br />
Failures:<br />
Device on test:<br />
Actual device hours:<br />
Mean :<br />
Equivalent device hours @ Tj=125C:<br />
Equivalent device hours @ Tj=55C:<br />
Equivalent device hours @ Tj=25C:<br />
Jan. 1, 2002<br />
P.100<br />
Failure Analysis:<br />
<strong>Reliability</strong> Testing Summary<br />
High Temperature Life Test<br />
Qualification & <strong>Monitor</strong> Combined<br />
Technology:<br />
Device Type:<br />
Package Type:<br />
Actual Temperature:<br />
Assumed Activation Energy:<br />
XCR5064 XCR3(5)128 XCR22(L)V10 XCR3(5)032 XCRXXXX<br />
2<br />
1<br />
150<br />
149,168<br />
994<br />
498,180<br />
38,769,847<br />
4.69E+08<br />
F/A(1)-Gate oxide defect<br />
Si Gate CMOS<br />
XCRXXX Microcircuit Group<br />
PLCC-28, 44, 84<br />
150C<br />
0.7 ev @ C.L. = 60%<br />
2<br />
2<br />
172<br />
133,072<br />
774<br />
444,424<br />
34,586,380<br />
4.18E+08<br />
F/A(2)-1-Idd failure,<br />
1-single bit charge loss<br />
1<br />
0<br />
154<br />
154,000<br />
1,000<br />
514,318<br />
40,025,719<br />
4.84E+08<br />
4<br />
0<br />
306<br />
306,000<br />
1,000<br />
1,021,956<br />
79,531,623<br />
9.62E+08<br />
Failure Rate (60% C.L.) in FITS @ Tj=55C:<br />
Failure Rate (60% C.L.) in FITS @ Tj=25C:<br />
9<br />
3<br />
782<br />
742,240<br />
949<br />
2,478,879<br />
192,913,568<br />
2.33E+09<br />
22<br />
2<br />
®
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