Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 196 Reliability Testing Summary Package Qualification / Monitor FG-256 Device Type: Package Type: Die Attach Material: XCV200, XCV50/E, XC2S100, XC2V1000 FG-256 Silver Epoxy Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/Cycles Temperature Cycle Pressure Pot Hast 85/85 Resistance to Solvents Physical Dimension Bond Pull Ball Shear Salt Atmosphere Note: Test condition for T/C was -55C/+125C 6 2 1 2 1 3 2 2 1 0 0 0 0 0 0 0 0 0 284 121 21 94 3 15 10 10 15 1,018 141 100 1,005 289,062 17,088 2,100 94,491 ®
Jan. 1, 2002 P. 197 Reliability Testing Summary Package Qualification / Monitor FG-456, 556 Device Type: Package Type: Die Attach Material: XCV300E, XCV200, XCV300, XCV1000 FG-456, 556 Silver Epoxy Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/Cycles Temperature Cycles Pressure Pot Hast Resistance to Solvents Physical Dimension Bond Pull Ball Shear Die Shear Note: Test condition for T/C was -55C/+125C 9 5 2 2 1 2 1 1 0 0 0 0 0 0 0 0 308 294 30 6 5 9 5 5 1,009 96 100 310,686 28,320 3,000 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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