18.07.2013 Views

Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Xilinx Reliability Monitor Report - Quarter 4 CY 2001

SHOW MORE
SHOW LESS

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

Combined Lots:<br />

Failures:<br />

Device on test:<br />

Actual device hours:<br />

Mean of Stress Test hour:<br />

Equivalent device hours @ Tj=125C:<br />

Equivalent device hours @ Tj=55C:<br />

Equivalent device hours @ Tj=25C:<br />

Jan. 1, 2002<br />

P. 124<br />

<strong>Reliability</strong> Testing Summary<br />

High Temperature Life Test<br />

Qualification & <strong>Monitor</strong> Combined<br />

Technology:<br />

Device Type:<br />

Package Type:<br />

Actual Junction Temperature:<br />

Assumed Activation Energy:<br />

Confidence Level:<br />

0.35um Si Gate CMOS<br />

XC18VXX<br />

VQFP-44<br />

145C<br />

0.58 ev<br />

60%<br />

XC18V04 XC18VXX<br />

2<br />

0<br />

152<br />

272,840<br />

1,795<br />

612,641<br />

22,600,792<br />

1.78E+08<br />

Failure Rate (60% C.L.) in FITS @ Tj=55C:<br />

Failure Rate (60% C.L.) in FITS @ Tj=25C:<br />

2<br />

0<br />

152<br />

272,840<br />

1,795<br />

612,641<br />

22,600,792<br />

1.78E+08<br />

41<br />

5<br />

®

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!