Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 6 2.2 Non-Hermetic Package/Assembly Qualification: Reliability Test Condition Duration Temperature Humidity Bias (THB) or High Accelerated stress Test (HAST) Temperature Cycling (TC) B 85°C, 85% R.H., V DD or 130°C, 85% R.H., V DD -65°C/+150°C, -55°C/+125°C, -40°C/+125°C or -0°C/+100°C 121°C, 100% R.H.or 1,000 hours or 100 hours 500 cycles or 1,000 cycles Lot Qty SS/lot A Acceptance 1 76 0 fail 1 76 0 fail Autoclave or 96 hours 1 76 0 fail Moisture Resistance 85°C, 85% R.H 1,000 hours Resistance to Solvent 1 3 0 fail Solderability 1 3 0 fail Lead Fatigue 1 3 0 fail Ball Shear 1 5(40) C 0 fail Bond Pull 1 5 (40) C 0 fail Note: A. The sample size listed is based on the die size
Jan. 1, 2002 P. 7 2.3 Device Qualification: For a new device from a previously qualified process, the requirements are as follows: Reliability Test Condition Lot Qty SS/lot A Acceptance ESD HBM 1 3 >/=2000V Latch up Current injection Ta =25°C 1 4 >/=200mA 2.4 Hermetic Packages: The hermetic package qualification requires a full group D test per MIL-STD-883, Method 5005. 2.5 Reliability Monitor 2.5.1 Wafer Process Reliability Test Condition Duration High Temperature Operating Life (HTOL) Data Retention A Extended Static Life Test Ta >/=125°C VDD Max A- For CPLD and Eprom products only. B. One lot is pulled per quarter to extend to 2,000 hours. Lot Qty SS/ process family/quarter 1,000 hours 1 45 0 fail Ta=150C 1,000 hours 1 45 0 fail Ta >/=125°C VDD Max 2,000 hours 1 B 45 0 fail Acceptance
Page 1 and 2: Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4: Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5: Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 9 and 10: Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12: Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14: Temperature (C o ) XILINX Typical C
Page 15 and 16: Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18: (1) Measured on XC1765D (2) Measure
Page 19 and 20: Jan. 1, 2002 P.19 Failure Rate Summ
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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