Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Jan. 1, 2002 P.106
Combined Started Lot:
Combined Completed Lots:
Failures:
Device on test:
Mean Test Cycles/Device:
Total Device Cycles:
Failure Analysis:
Reliability Testing Summary-Packages
Temperature Cycle (Air to Air)
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Test Condition:
Si Gate CMOS
XCRXXXXL Microcircuit Group
TQ-144, CS-144, 48, 280, VQFP-44, PLCC-44
*T = -55C/+125C (Air to Air)
T = -65C/+150C (Air to Air)
XCR3256XL XCR3032XL XCR3128XL XCR3364XL
2
2
0
150
909
136,342
*1
1
0
76
1,077
81,852
2
2
0
152
1,000
152,000
*1
1
0
76
1,000
76,000
*1
1
0
76
1,000
76,000
*1
1
0
50
1,000
50,050
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