Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Combined Started Lots: Failures: Device on test: Actual device hours: Mean of Stress Test hour: Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Jan. 1, 2002 P. 122 Failure Analysis: Reliability Testing Summary High Temperature Life Test Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Temperature: Assumed Activation Energy: Confidence Level: 0.6um Si Gate CMOS XC17SXXXL PD8, CC-44 145C 0.58 ev 60% XC17S10XL XC17S40XL XC17S50XL XC17S150XL XC17SXXXL 3 0 197 203,230 1,032 456,337 16,834,625 1.33E+08 1 0 107 109,461 1,023 245,786 9,067,238 7.15E+07 1 0 41 41,820 1,020 93,904 3,464,174 2.73E+07 4 0 184 121,174 659 272,087 10,037,489 7.92E+07 9 0 529 475,685 899 1,068,114 39,403,525 3.11E+08 Failure Rate (60% C.L.) in FITS @ Tj=55C: 23 Failure Rate (60% C.L.) in FITS @ Tj=25C: 3 ®
Combined Lots: Failures: Device on test: Actual device hours: Mean of Stress Test hour: Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Oct. 1, 2001 P. 123 Failure Analysis: Reliability Testing Summary High Temperature Life Test Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Temperature: Assumed Activation Energy: Confidence Level: 0.35um Si Gate CMOS XC17VXX PD8, VQFP-44 145C 0.58 ev 60% XC17V01 XC17V04 XC17V16 XC17VXXX 1 0 77 79,079 1,027 177,566 6,550,535 5.17E+07 5 2 379 267,429 706 600,491 22,152,570 1.75E+08 FA 00200(2)-RAND 2 0 151 116,192 769 260,900 9,624,803 7.59E+07 Failure Rate (60% C.L.) in FITS @ Tj=55C: Failure Rate (60% C.L.) in FITS @ Tj=25C: 8 2 607 462,700 762 1,038,957 38,327,908 2.04E+08 81 10 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 P. 173 Reliability Tes
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Jan. 1, 2002 P. 209 Combined Starte
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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