Xilinx Reliability Monitor Report - Quarter 4 CY 2001
Xilinx Reliability Monitor Report - Quarter 4 CY 2001
Xilinx Reliability Monitor Report - Quarter 4 CY 2001
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Combined Started Lots:<br />
Failures:<br />
Device on test:<br />
Actual device hours:<br />
Mean of Stress Test hour:<br />
Equivalent device hours @ Tj=125C:<br />
Equivalent device hours @ Tj=55C:<br />
Equivalent device hours @ Tj=25C:<br />
Jan. 1, 2002 P. 122<br />
Failure Analysis:<br />
<strong>Reliability</strong> Testing Summary<br />
High Temperature Life Test<br />
Qualification & <strong>Monitor</strong> Combined<br />
Technology:<br />
Device Type:<br />
Package Type:<br />
Actual Temperature:<br />
Assumed Activation Energy:<br />
Confidence Level:<br />
0.6um Si Gate CMOS<br />
XC17SXXXL<br />
PD8, CC-44<br />
145C<br />
0.58 ev<br />
60%<br />
XC17S10XL XC17S40XL XC17S50XL XC17S150XL XC17SXXXL<br />
3<br />
0<br />
197<br />
203,230<br />
1,032<br />
456,337<br />
16,834,625<br />
1.33E+08<br />
1<br />
0<br />
107<br />
109,461<br />
1,023<br />
245,786<br />
9,067,238<br />
7.15E+07<br />
1<br />
0<br />
41<br />
41,820<br />
1,020<br />
93,904<br />
3,464,174<br />
2.73E+07<br />
4<br />
0<br />
184<br />
121,174<br />
659<br />
272,087<br />
10,037,489<br />
7.92E+07<br />
9<br />
0<br />
529<br />
475,685<br />
899<br />
1,068,114<br />
39,403,525<br />
3.11E+08<br />
Failure Rate (60% C.L.) in FITS @ Tj=55C: 23<br />
Failure Rate (60% C.L.) in FITS @ Tj=25C: 3<br />
®
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