Xilinx Reliability Monitor Report - Quarter 4 CY 2001

More documents

Recommendations

Info

Combined Started Lot: Combined Completed Lots: Jan. 1, 2002 P. 208 Failures: Device on test: Failure Analysis: <strong>Reliability</strong> Testing Summary-Packages EIAJ Temperature Soldering Heat Test Technology: Device Type: Package Type: Assembly: Pre-conditionning Test Condition: Test Duration: Solder Heat Temp.: Test Duration: Note : Solderability test applied to all leads Si-Gate CMOS XC17XXX Microcircuit Group PD8, SO20, VO8, VQ44 AAPI T = 85C, R.H. = 85% 240 hours 350 +/- 10 degrees C 3 + 0.5/-0 seconds XC17S20 XC17S40 XC17128E XC1702L XC17XXX 1 1 0 3 1 1 0 3 1 1 0 3 1 1 0 3 4 4 0 12 ®
Jan. 1, 2002 P. 209 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Failure Analysis: <strong>Reliability</strong> Testing Summary-Packages EIAJ Temperature Soldering Heat Test Technology: Device Type: Package Type: Assembly: Pre-conditionning Test Condition: Test Duration: Solder Heat Temp.: Test Duration: Note : Solderability test applied to all leads Si-Gate CMOS XC3XXX/A Microcircuit Group PLCC-44, VQFP-100 Anam T = 85C, R.H. = 85% 240 hours 350 +/- 10 degrees C 3 + 0.5/-0 seconds XC3030/A XC3042/A XC3XXX/A 1 1 0 3 1 1 0 3 2 2 0 6 ®
Page 1 and 2:
Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4:
Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6:
Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8:
Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10:
Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12:
Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14:
Temperature (C o ) XILINX Typical C
Page 15 and 16:
Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18:
(1) Measured on XC1765D (2) Measure
Page 19 and 20:
Jan. 1, 2002 P.19 Failure Rate Summ
Page 21 and 22:
Combined Lots: Failures: Device on
Page 23 and 24:
Page 25 and 26:
Page 27 and 28:
Page 29 and 30:
Page 31 and 32:
Page 33 and 34:
Page 35 and 36:
Page 37 and 38:
Page 39 and 40:
Page 41 and 42:
Page 43 and 44:
Page 45 and 46:
Page 47 and 48:
Jan. 1, 2002 P.47 Combined Started
Page 49 and 50:
Page 51 and 52:
Page 53 and 54:
Page 55 and 56:
Page 57 and 58:
Page 59 and 60:
Page 61 and 62:
Page 63 and 64:
Page 65 and 66:
Page 67 and 68:
Page 69 and 70:
Page 71 and 72:
Page 73 and 74:
Page 75 and 76:
Page 77 and 78:
Page 79 and 80:
Page 81 and 82:
Jan. 1, 2002 Combined Started Lot:
Page 83 and 84:
Page 85 and 86:
Page 87 and 88:
Combined Started Lot: Combined Comp
Page 89 and 90:
Page 91 and 92:
Page 93 and 94:
Jan. 1, 2002 Combined Started Lot:
Page 95 and 96:
Page 97 and 98:
Page 99 and 100:
Page 101 and 102:
Page 103 and 104:
Page 105 and 106:
Page 107 and 108:
Page 109 and 110:
Page 111 and 112:
Page 113 and 114:
Page 115 and 116:
Page 117 and 118:
Page 119 and 120:
Page 121 and 122:
Page 123 and 124:
Page 125 and 126:
Page 127 and 128:
Page 129 and 130:
Jan. 1, 2002 P. 129 Combined Starte
Page 131 and 132:
Page 133 and 134:
Page 135 and 136:
Page 137 and 138:
Page 139 and 140:
Page 141 and 142:
Page 143 and 144:
Page 145 and 146:
Page 147 and 148:
Page 149 and 150:
Page 151 and 152:
Page 153 and 154:
Page 155 and 156:
Page 157 and 158: Jan. 1, 2002 P. 157 Combined Starte
Page 169 and 170: Combined Started Lot: Combined Comp
Page 173 and 174: Jan. 1, 2002 P. 173 Reliability Tes
Page 207: Jan. 1, 2002 P. 207 Reliability Tes
Page 217 and 218: Package Details Motherboard Design
Page 219 and 220: Package Motherboard Jan. 1, 2002 P
Page 221 and 222: Package Motherboard Jan. 1, 2002 P
show all

Xilinx Reliability Monitor Report - Quarter 4 CY 2001

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?