Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 200 Reliability Testing Summary Package Qualification / Monitor FG-900 Device Type: Package Type: Die Attach Material: XCV1000E, XCV1600E FG-900 Silver Epoxy Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/Cycles T/C Hast Pressure Pot Resistance to Solvents Ball Shear Bond Pull Physical Dimension Salt Atmosphere Note: Test condition for T/C was -55C/+125C 3 3 2 2 2 2 2 1 0 0 0 0 0 0 0 0 74 66 54 6 10 10 10 3 1,070 100 168 79,190 6,600 9,072 ®
Jan. 1, 2002 P. 201 Reliability Testing Summary Package Qualification / Monitor FG-1156 Device Type: Package Type: Die Attach Material: XCV2000E, XCV3200EA FG-1156 Silver Epoxy Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/Cycles Temperature Cycle Hast Pressure Pot 85/85 Resistance to Solvents Ball Shear Bond Pull Physical Dimension Note: Test condition for T/C was -55C/+125C 6 1 2 1 1 1 1 2 0 0 0 0 0 0 0 0 113 22 40 19 3 5 5 10 940 100 136 1,014 106,188 2,200 5,424 19,266 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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