Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Combined Lots:
Failures:
Device on test:
Actual device hours:
Average Test Time :
Equiv. device hrs @ Tj=125C:
Equiv. device hrs @ Tj=55C:
Equiv. device hrs @ Tj=25C:
Jan. 1, 2002
P.42
Failure Analysis:
Reliability Testing Summary
High Temperature Life Test
Qualification
Technology:
Device Type:
Package Type:
Actual Junction Temperature:
Assumed Activation Energy:
Confidence Level:
0.18 um Si Gate CMOS
XCVXXXE
HQFP-240, PQFP-240, BG-560
145C , *125C
0.70 ev
60%
XCV1000E XCV1600E XCV2000E XCVXXXE
*4
0
127
115,142
907
115,142
8,960,686
1.08E+08
*3
0
75
62,725
836
62,725
4,881,442
5.90E+07
*3
0
54
49,323
913
49,323
3,838,459
4.64E+07
Failure Rate(60% C.L.) in FITS @ Tj=55C:
Failure Rate(60% C.L.) in FITS @ Tj=25C:
21
2
879
672,407
765
1,409,012
109,653,418
1.33E+09
28
2
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