Xilinx Reliability Monitor Report - Quarter 4 CY 2001

More documents

Recommendations

Info

Jan. 1, 2002 P. 172 Package Qualification & Monitor Program
Jan. 1, 2002 P. 173 Reliability Testing Summary Package Qualification / Monitor PD-8 Device Type: Package Type: Die Attach Material: Molding Compound: XC1701L, XC17256E PD8 Silver Epoxy Sumitomo 6300H & Shenitsu KMC-1805 Reliability Combined Device Mean Test Total Test No. Lots Failures On Test Hrs/Cycles Device Hrs/Cycles Temperature Cycle Pressure Pot 85/85 Solderability Resistance to Solvents Lead Fatigue Physical Dimension 2 3 3 3 3 3 3 0 0 0 0 0 0 0 90 135 135 9 9 10 15 1,068 96 1,169 96,075 12,960 157,815 ®
Page 1 and 2:
Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4:
Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6:
Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8:
Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10:
Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12:
Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14:
Temperature (C o ) XILINX Typical C
Page 15 and 16:
Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18:
(1) Measured on XC1765D (2) Measure
Page 19 and 20:
Jan. 1, 2002 P.19 Failure Rate Summ
Page 21 and 22:
Combined Lots: Failures: Device on
Page 23 and 24:
Page 25 and 26:
Page 27 and 28:
Page 29 and 30:
Page 31 and 32:
Page 33 and 34:
Page 35 and 36:
Page 37 and 38:
Page 39 and 40:
Page 41 and 42:
Page 43 and 44:
Page 45 and 46:
Page 47 and 48:
Jan. 1, 2002 P.47 Combined Started
Page 49 and 50:
Page 51 and 52:
Page 53 and 54:
Page 55 and 56:
Page 57 and 58:
Page 59 and 60:
Page 61 and 62:
Page 63 and 64:
Page 65 and 66:
Page 67 and 68:
Page 69 and 70:
Page 71 and 72:
Page 73 and 74:
Page 75 and 76:
Page 77 and 78:
Page 79 and 80:
Page 81 and 82:
Jan. 1, 2002 Combined Started Lot:
Page 83 and 84:
Page 85 and 86:
Page 87 and 88:
Combined Started Lot: Combined Comp
Page 89 and 90:
Page 91 and 92:
Page 93 and 94:
Jan. 1, 2002 Combined Started Lot:
Page 95 and 96:
Page 97 and 98:
Page 99 and 100:
Page 101 and 102:
Page 103 and 104:
Page 105 and 106:
Combined Started Lot: Combined Comp
Page 107 and 108:
Page 109 and 110:
Page 111 and 112:
Page 113 and 114:
Page 115 and 116:
Page 117 and 118:
Page 119 and 120:
Page 121 and 122: Combined Lots: Failures: Device on
Page 127 and 128: Combined Started Lot: Combined Comp
Page 129 and 130: Jan. 1, 2002 P. 129 Combined Starte
Page 169 and 170: Combined Started Lot: Combined Comp
Page 171: Jan. 1, 2002 P. 171 Combined Starte
Page 175 and 176: Jan. 1, 2002 P. 175 Reliability Tes
Page 217 and 218: Package Details Motherboard Design
Page 219 and 220: Package Motherboard Jan. 1, 2002 P
Page 221 and 222: Package Motherboard Jan. 1, 2002 P
show all

Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Create successful ePaper yourself

Delete template?

Save as template?