Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Combined Lots: Failures: Device on test: Actual device hours: Mean of Stress Test hour: Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Jan. 1, 2002 P. 120 Failure Analysis: Reliability Testing Summary High Temperature Life Test Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Junction Temperature: Assumed Activation Energy: Confidence Level: 0.6um Si Gate CMOS XC17XXL PD8, VQFP-44, CC-44 145C 0.58 ev 60% XC1701L XC1704L XC17XXL 5 0 229 166,444 727 373,737 13,787,444 1.09E+08 1 0 78 78,468 1,006 176,194 6,499,923 5.13E+07 Failure Rate (60% C.L.) in FITS @ Tj=55C: Failure Rate (60% C.L.) in FITS @ Tj=25C: 6 0 307 244,912 798 549,931 20,287,367 1.60E+08 45 6 ®
Combined Lots: Failures: Device on test: Actual device hours: Mean of Stress Test hour: Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Jan. 1, 2002 P. 121 Reliability Testing Summary High Temperature Life Test Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Junction Temperature: Assumed Activation Energy: Confidence Level: 0.6um Si Gate CMOS XC17SXX PD8, CC44 145C 0.58 ev 60% XC17S05 XC17S20 X C17S30 XC17S40* XC17SXX 1 0 106 108,438 1,023 243,489 8,982,498 7.08E+07 1 0 106 108,438 1,023 243,489 8,982,498 7.08E+07 3 0 197 203,230 1,032 456,337 16,834,625 1.33E+08 5 0 244 324,730 1,331 729,156 26,899,117 2.12E+08 10 0 653 744,836 1,141 1,672,471 61,698,738 4.87E+08 Failure Rate (60% C.L.) in FITS @ Tj=55C: 15 Failure Rate (60% C.L.) in FITS @ Tj=25C: 2 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 P. 173 Reliability Tes
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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