Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 182 Reliability Testing Summary Package Qualification / Monitor TQFP Device Type: Package Type: Die Attach Material: Molding Compound: XC4010XL, XC9572, XC95144XL, XC2S50 XCS30/XL, XCR3256XL, XCV100, XC3090A TQFP- 100, 144 & 176 Silver Epoxy EME-7320, E7N32 Reliability Combined Device Mean Test Total Test No. Lots Failures On Test Hrs/Cycles Device Hrs/cycles Temperature cycle Pressure Pot 85/85 Solderability Resistance to Solvents Lead Fatigue Physical Dimension Bond Pull 12 6 2 3 3 1 3 1 0 0 0 0 0 0 0 0 Die shear 1 0 5 ® 674 338 56 9 9 3 15 5 1,020 145 906 667,351 48,864 50,747
Jan. 1, 2002 P. 183 Reliability Testing Summary Package Qualification / Monitor VQFP Device Type: Package Type: Die Attach Material: Molding Compound: XCS30/XL, XC9536/XL, XC1V716 XC18V04, XCR5064, XCR3032XL VQFP- 44, 64, 100 Silver Epoxy EME-7320 Reliability Combined Device Mean Test Total Test No.Lots Failures On Test Hrs/Cycles Device Hrs/cycles Temperature Cycle Pressure Pot 85/85 Resistance to Solvents Lead Fatigue Physical Dimension Solderability Die shear 13 3 7 4 3 2 3 1 1* 0 0 0 0 0 0 0 1,090 197 381 12 9 10 9 5 575 96 895 *F/A00154(2)-ASL 626,505 18,912 341,151 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Jan. 1, 2002 Combined Started Lot:
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Jan. 1, 2002 P. 129 Combined Starte
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Page 217 and 218: Package Details Motherboard Design
Page 219 and 220: Package Motherboard Jan. 1, 2002 P
Page 221 and 222: Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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