Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 164 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Hours/Device: Total Device Hours: Reliability Testing Summary-Packages Data Retention Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XC18VXX VQFP-44, SOIC-20, PLCC-20, 44 150C XC18V01 XC18V04 XC18VXX 3 3 0 88 1,798 158,224 3 3 0 119 1,155 156,970 6 6 0 207 1,429 295,702 ®
Jan. 1, 2002 P. 165 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Hours/Device: Total Device Hours: Failure Analysis Number: Reliability Testing Summary-Packages Data Retention Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XC95XXX PLCC- 44, PQFP-160, HQFP-208 150C XC95108 XC95144 XC9536 XC95288 XC95XXX 2 2 0 66 1,711 112970 1 1 0 44 1,000 44,000 3 3 0 226 1,815 410,106 1 1 0 21 2,101 44,121 7 7 0 357 1,305 466,007 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Combined Started Lot: Combined Comp
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Jan. 1, 2002 P. 215 Combined Starte
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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