Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 138 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Hour s/Device: Total Device Hours: Failure Analysis Number: Reliability Testing Summary-Packages Pressure Pot Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XC17XX /L PD-8 T = 121C, 100% R.H. XC1701/L XC17XX/L 1 1 0 45 96 4,320 1 1 0 45 96 4,320 ®
Jan. 1, 2002 P. 139 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Hour s/Device: Total Device Hours: Failure Analysis Number: Reliability Testing Summary-Packages Pressure Pot Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XC17XXXE Microcircuit Group PD-8 T = 121C, 100% R.H. XC17256E XC17XXXE 1 1 0 45 96 4,320 1 1 0 45 96 4,320 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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