Xilinx Reliability Monitor Report - Quarter 4 CY 2001
Xilinx Reliability Monitor Report - Quarter 4 CY 2001
Xilinx Reliability Monitor Report - Quarter 4 CY 2001
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Combined Lots:<br />
Failures:<br />
Device on test:<br />
Actual device hours:<br />
Mean of Stress Test hour:<br />
Equivalent device hours @ Tj=125C:<br />
Equivalent device hours @ Tj=55C:<br />
Equivalent device hours @ Tj=25C:<br />
Failure Rate (60% C.L.) in FITS @ Tj=55C:<br />
Failure Rate (60% C.L.) in FITS @ Tj=25C:<br />
Jan. 1, 2002<br />
P. 118<br />
<strong>Reliability</strong> Testing Summary<br />
High Temperature Life Test<br />
Qualification & <strong>Monitor</strong> Combined<br />
Technology:<br />
Device Type:<br />
Package Type:<br />
Actual Junction Temperature:<br />
Assumed Activation Energy:<br />
Confidence Level:<br />
Si Gate CMOS<br />
XC17VXX, XC18VXX, XC95XXX, XC95XXXXL<br />
Various<br />
145C<br />
0.58 ev for Eprom; 0.7 e.v. for XC95XXX<br />
@ C.L. = 60%<br />
XC17VXX XC18VXX XC95XX XC95XXXXL<br />
8<br />
2<br />
607<br />
462,700<br />
762<br />
1,038,957<br />
38,327,908<br />
2.04E+08<br />
81<br />
10<br />
3<br />
0<br />
152<br />
272,840<br />
1,795<br />
612,641<br />
22,600,792<br />
1.78E+08<br />
41<br />
5<br />
6<br />
0<br />
330<br />
229,938<br />
697<br />
610,367<br />
47,500,542<br />
5.74E+09<br />
19<br />
2<br />
8<br />
0<br />
632<br />
461,807<br />
731<br />
1,225,860<br />
95,399,990<br />
1.15E+09<br />
10<br />
1<br />
®
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