Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Combined Lots: Failures: Device on test: Actual device hours: Average Test Time : Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Jan. 1, 2002 P.38 Failure Analysis: <strong>Reliability</strong> Testing Summary High Temperature Life Test Qualification Technology: Device Type: Package Type: Actual Temperature Assumed Activation Energy: Confidence Level: XCV200 XCV300 XCV400 XCV600 1 0 75 57,600 768 152,898 11,898,995 1.44E+08 0.22um Si Gate CMOS XCVXXX HQFP-240, PQFP-240, *BG560, CB-228 145C, 125C* 0.70 ev 60% 5 1 285 280,710 985 745,141 57,989,011 7.01E+08 FA00072(1)-RAND 1 0 76 45,904 604 121,851 9,482,838 1.15E+08 1 0 21 9,492 452 25,196 1,960,855 2.37E+07 ®
Combined Lots: Failures: Device on test: Actual device hours: Average Test Time : Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Jan. 1, 2002 P.39 Failure Analysis: <strong>Reliability</strong> Testing Summary High Temperature Life Test Qualification Technology: Device Type: Package Type: Actual Junction Temperature: Assumed Activation Energy: Confidence Level: 0.22um Si Gate CMOS XCVXXX HQFP-240, PQFP-240, *BG560, CB-228 145C , 125C* 0.70 ev 60% XCV800 XCV800 XCV1000 XCVXXX 2 0 48 44,547 928 118,249 9,202,510 1.11E+08 *1 0 22 22,308 1,014 22,308 1,736,073 2.10E+07 *1 0 5 5,000 1,000 5,000 389,115 4.70E+06 Failure Rate(60% C.L.) in FITS @ Tj=55C: Failure Rate(60% C.L.) in FITS @ Tj=25C: 12 1 488 392,297 804 996,166 77,524,536 9.37E+08 26 2 ®
Page 1 and 2: Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4: Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6: Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8: Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10: Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12: Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14: Temperature (C o ) XILINX Typical C
Page 15 and 16: Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18: (1) Measured on XC1765D (2) Measure
Page 19 and 20: Jan. 1, 2002 P.19 Failure Rate Summ
Page 21 and 22: Combined Lots: Failures: Device on
Page 37: Combined Lots: Failures: Device on
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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