Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 176 Reliability Testing Summary Package Qualification / Monitor PLCC-44 Device Type: Package Type: Die Attach Material: Molding Compound: XC9536, XC9572, XC1704L, XC17V16, 18V04, XCR3064XL, XCR3032XL PLCC- 44 Silver Epoxy Sumitomo 6300H, MP8000 Reliability Combined Device Mean Test Total Test No. Lots Failures On Test Hrs/Cycles Device Hrs/cycles Temperature Cycle Pressure Pot Physical Dimension Bond Pull Die Shear 23 17 1 1 1 0 0 0 0 0 1,376 1,054 5 3 3 967 119 1,330,032 125,808 ®
Jan. 1, 2002 P. 177 Reliability Testing Summary Package Qualification / Monitor PLCC-84 Device Type: Package Type: Die Attach Material: Molding Compound: XC4010XL, XC9572 PLCC- 84 Silver Epoxy Sumitomo 6300H, MP8000 Reliability Combined Device Mean Test Total Test No. Lots Failures On Test Hrs/Cycles Device Hrs/cycles Temperature Cycle Pressure Pot 85/85 Solderability Resistance to Solvents Lead Fatigue Physical Dimension Bond Pull 3 2 1 2 2 2 2 1 0 0 0 0 0 0 0 0 197 90 46 6 6 6 10 5 813 96 1,006 160,140 8,640 45,270 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Jan. 1, 2002 Combined Started Lot:
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Page 173 and 174: Jan. 1, 2002 P. 173 Reliability Tes
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Page 217 and 218: Package Details Motherboard Design
Page 219 and 220: Package Motherboard Jan. 1, 2002 P
Page 221 and 222: Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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