Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Jan. 1, 2002
Combined Started Lot:
Combined Completed Lots:
P.80
Failures:
Device on test:
Mean Test Cycles/Device:
Total Device Cycles:
Reliability Testing Summary-Packages
Temperature Cycle (Air to Air)
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Test Condition:
XC4062XLA XC4062XLA* XC4085XLA* XC40XXXLA
1
1
0
34
1,004
34,136
Si Gate CMOS
XC4XXXXLA
HQFP-240, 304, PQFP-240, BG-256, 352, 432, 560
T = -65C/+150C (Air to Air)
*For BGA, T=-55C/+125C (Air to Air)
2
2
0
90
1,000
90,000
3
3
0
134
1,000
134,000
3
3
0
134
1,000
134,000
®