Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 214 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Failure Analysis: <strong>Reliability</strong> Testing Summary-Packages Low Temperature Soldering Heat Test Technology: Device Type: Package Type: Steam Age: Flux: Solder Heat Temp.: Si-Gate CMOS XC17XXX Microcircuit Group PLCC-20, DD-8 2 hours RMA 215 +/- 5 degrees C XC17256D XC17XXX Note : Solderability test applied to the number of leads LTPD 10, 22 leads accept on0 2 2 0 8 2 2 0 8 ®
Jan. 1, 2002 P. 215 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Failure Analysis: <strong>Reliability</strong> Testing Summary-Packages Low Temperature Soldering Heat Test Technology: Device Type: Package Type: Steam Age: Flux: Solder Heat Temp.: Si-Gate CMOS XC4XXX Microcircuits Group PQFP-160,240, PLCC-84, HQFP-304, VQFP-100 2 hours RMA 215 +/- 5 degrees C XC4005XL XC4044XL XC4013XLA XC4XXX 2 2 0 7 Note : Solderability test applied to the number of leads LTPD 10, 22 leads accept on0 1 1 0 3 2 2 0 6 5 5 0 16 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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