Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Jan. 1, 2002
P.76
Combined Started Lot:
Combined Completed Lots:
Failures:
Device on test:
Mean Test Cycles/Device:
Total Device Cycles:
Reliability Testing Summary-Packages
Temperature Cycle (Air to Air)
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Test Condition:
Si Gate CMOS
XC4XXX
PQFP-208, PGA-223
T = -65C/+150C (Air to Air)
XC4010E XC4013E XC4020E XC4XXXE
1
1
0
35
1,043
36,505
2
2
0
30
1,000
30,000
1
1
0
45
1,000
45,000
4
4
0
110
1,014
111,505
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