Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Jan. 1, 2002
P.83
Combined Started Lot:
Combined Completed Lots:
Failures:
Device on test:
Mean Test Cycles/Device:
Total Device Cycles:
Failure Analysis Number:
Reliability Testing Summary-Packages
Temperature Cycle (Air to Air)
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Test Condition:
XC2S50 XC2S100 XC2S150
3
3
0
55
1,062
58,410
Si Gate CMOS
XC2SXXX /E
PQFP-208, FG-256, TQFP-144, FT-256
T = -65C/+150C (Air toAir)
T = -55C/+125C (Air to Air)
1
1
0
45
1,000
45,000
2
2
0
143
1,244
177,814
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