Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 2 TABLE OF CONTENTS Introduction ............................................................................................................................................…4 The Reliability Program........... .................................................................................................................…4 New Process Qualification....................................................................................................……… 5 New Package Qualifications............................................................................................................…6 New Device Qualification………………………………...…………………………………………………7 Reliability Monitor.............................................................................................................................….6 Process Monitor....................................................................................................................…...7 Assembly Package Monitor.....................................................................................................…8 Process Technology Family......................................................................................................................….9 Failure Analysis......................................................................................................................................…..10 Failure Rate Determination............…………...........................................................................…….…10 Table I Failure Analysis Acronyms.................….................................................…………...........…….11
Jan. 1, 2002 P. 3 TABLE OF CONTENTS Continued Plastic Encapsulant Data............................…..........................................................................................12 Typical IR-Reflow Profile.......…...............…..............................................................................................13 Product Moisture Classification...….….………………………………………………………………………….14 ESD & Latch-up Data...….................................................................................................................. 15 - 17 The FPGA Products...….…..........................................................................................................…18 - 97 The Coolrunner Products……...................................................................................................…. 98 - 115 The CPLD and EPROM Products..….........................................................................................…116 - 171 Package Qualification & Monitor...............................................................................................….172 - 207 Plastic Package Qualification Test Data ......................…............................................................. 172 - 203 Ceramic Package Qualification Test Data ..…............................................................................…204- 207 Solderability Test Qualification per EIAJ ..............…..................................................................…208 - 213 Low Temperature Soldering Test....….........................................................................................…214 -215 Board Level Reliability Tests….......….........................................................................................…216 -222
Page 1: Jan. 1, 2002 P. 1 The Reliability D
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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