Xilinx Reliability Monitor Report - Quarter 4 CY 2001

Jan. 1, 2002
P. 155
Combined Started Lot:
Combined Completed Lots:
Failures:
Device on test:
Mean Test Cycles/Device:
Total Device Cycles:
Failure Analysis Number:
Reliability Testing Summary-Packages
Temperature Cycle (Air to Air)
Qualification & Monitor Combined
Technology:
Device Type:
Package Type:
Test Condition:
Si Gate CMOS
XC95XXXL
PQFP-208, TQFP-144, CS-144-280, VQFP-64, PLCC-44
T = -65C/+150C (Air to Air)
T = -55C / +125C (Air to Air) for CS* & BGA*
XC95288XL* XC9536XL XC9572XL XC95XXXXL
1
1
0
76
1,000
76,000
1
1
0
76
1,000
76,000
2
2
0
151
1,000
151,000
9
9
0
647
1,019
659,322
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