Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 Combined Started Lot: Combined Completed Lots: P.46 Failures: Device on test: Mean Test Hours/Device: Total Device Hours: Reliability Testing Summary-Packages Bias Moisture Life Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XC4XXXE, XC4XXXXL, XC4XXXXLA, XCSXX Various T=85C, R.H.=85% XC4XXXE XC4XXXXL XC4XXXXLA XCSXX 2 2 0 119 1,091 129,866 6 6 0 224 1,059 237,160 3 3 0 127 1,030 130,768 1 1 0 45 1,005 45,225 ®
Jan. 1, 2002 P.47 Combined Started Lot: Combined Completed Lots: Failures: Device on test: Mean Test Hours/Device: Total Device Hours: Reliability Testing Summary-Packages Bias Moisture Life Qualification & Monitor Combined Technology: Device Type: Package Type: Test Condition: Si Gate CMOS XCSXXXL, XCVXXX/E, XC2VXXX Various T=85C, R.H.=85% XCSXXXL XCVXXX XCVXXXE XC2VXXX 1 1 0 11 1,019 11,209 5 5 1 153 1,053 161,170 6 6 0 204 1,055 215,128 10 10 0 296 1,016 300,834 ®
Page 1 and 2: Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4: Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6: Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8: Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10: Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12: Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14: Temperature (C o ) XILINX Typical C
Page 15 and 16: Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18: (1) Measured on XC1765D (2) Measure
Page 19 and 20: Jan. 1, 2002 P.19 Failure Rate Summ
Page 21 and 22: Combined Lots: Failures: Device on
Page 45: Combined Lots: Failures: Device on
Page 49 and 50: Jan. 1, 2002 P.49 Combined Started
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Jan. 1, 2002 P.97 Combined Started
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Combined Lots: Failures: Device on
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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