Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 206 Reliability Testing Summary DD8 Package Qualification / Monitor Combined Mean Hrs/Cycles Total Code Test Sample Failures Per Device Dev. Hours/Cycles B2 B3 B5 D1 D2 D3 D4 D5 D6 D7 D8 Resistance to Solvents Solderability Bond Strength Physical Dimension Lead Integrity Seal Thermal Shock Temperature Cycle Seal Visual Examination End-Point Elect. Parametrics Mechanical Shock Vibration, Var. Freq. Constant Accel. Seal Visual Examination End-Point Elec. Para. Salt Atmosphere Seal Visual Examination Internal Water-Vapor Content Adhesion of lead finish Lead Torque 30 27 36 75 21 75 75 75 15 15 25 0 0 0 0 0 0 0 0 0 0 0 15 100 1,125 7,500 ®
Jan. 1, 2002 P. 207 Reliability Testing Summary Chip Scale (CC) Package Qualification / Monitor Combined Mean Hrs/Cycles Total Code Test Sample Failures Per Device Dev. Hours/Cycles B2 B3 B5 D1 D2 D3 D4 D5 D6 D7 D8 Resistance to Solvents Solderability Bond Strength Physical Dimension Lead Integrity Seal Thermal Shock Temperature Cycle Seal Visual Examination End-Point Elect. Parametrics Mechanical Shock Vibration, Var. Freq. Constant Accel. Seal Visual Examination End-Point Elec. Para. Salt Atmosphere Seal Visual Examination Internal Water-Vapor Content Adhesion of lead finish Lead Torque 42 9 12 30 6 30 30 30 8 12 8 0 0 0 0 0 0 0 0 0 0 0 15 100 450 3,000 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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