Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 178 Reliability Testing Summary Package Qualification / Monitor PQFP-100 Device Type: Package Type: Die Attach Material: Molding Compound: XC9572 PQFP- 100 Silver Epoxy Sumitomo 6300H, EME-7304LC, E7N36 & MP8000 Reliability Combined Device Mean Test Total Test No. Lots Failures On Test Hrs/Cycles Device Hrs/Cycles Temperature Cycle Pressure Pot 3 3 0 0 228 226 1,019 168 232,332 37,968 ®
Jan. 1, 2002 P. 179 Reliability Testing Summary Package Qualification / Monitor PQFP-160 Device Type: Package Type: Die Attach Material: Molding Compound: XC95216, XC95108, XC4006E PQFP- 160 Silver Epoxy Sumitomo 6300H, EME-7304LC, E7N36 & MP8000 Reliability Combined Device Mean Test Total Test No. Lots Failures On Test Hrs/Cycles Device Hrs/cycles Temperature Cycle 85/85 Die Shear Resistance to Solvents Bond Pull Salt Atmosphere 2 1 1 1 1 1 0 0 0 0 0 0 91 76 5 3 5 15 1,064 1,071 85,366 81,376 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Page 217 and 218: Package Details Motherboard Design
Page 219 and 220: Package Motherboard Jan. 1, 2002 P
Page 221 and 222: Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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