Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Combined Lots: Failures: Device on test: Actual device hours: Average Test Time : Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Jan. 1, 2002 P.32 Reliability Testing Summary High Temperature Operating Life Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Junction Temperature: Assumed Activation Energy: confidence Level: 0.25um Si Gate CMOS XC4XXXXLA PQFP-240, HQFP-240 145C 0.70 ev 60% XC4062XLA XC4085XLA XC40XXXLA 3 0 149 165,609 1,111 439,607 34,211,471 4.14E+08 1 0 41 41,000 1,000 108,834 8,469,771 1.02E+08 8 0 362 334,304 923 887,397 65,059,828 8.35E+08 Failure Rate (60% C.L.) in FITS @ Tj=55C: 13 Failure Rate (60% C.L.) in FITS @ Tj=25C: 1 ®
Combined Lots: Failures: Device on test: Actual device hours: Average Test Time : Equivalent device hours @ Tj=125C: Equivalent device hours @ Tj=55C: Equivalent device hours @ Tj=25C: Jan. 1, 2002 P.33 Reliability Testing Summary High Temperature Operating Life Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Junction Temperature: Assumed Activation Energy: Confidence Level: XCS20 XCS30 XCS40 XCSXX 2 0 84 84,840 1,017 113,384 8,823,849 1.07E+08 0.35um Si Gate CMOS XCSXX PQFP-208 145C 0.70 ev 60% 1 0 42 42,084 1,002 111,711 8,693,704 1.05E+08 1 0 42 42,000 1,000 111,488 8,676,351 1.05E+08 Failure Rate (60% C.L.) in FITS @ Tj=55C: Failure Rate (60% C.L.) in FITS @ Tj=25C: 4 0 168 168,924 1,006 448,406 34,896,283 4.22E+08 26 2 ®
Page 1 and 2: Jan. 1, 2002 P. 1 The Reliability D
Page 3 and 4: Jan. 1, 2002 P. 3 TABLE OF CONTENTS
Page 5 and 6: Jan. 1, 2002 P. 5 2.1 Wafer Process
Page 7 and 8: Jan. 1, 2002 P. 7 2.3 Device Qualif
Page 9 and 10: Jan. 1, 2002 4. Failure Analysis: A
Page 11 and 12: Jan. 1, 2002 P. 11 F/A ACRONYM DESC
Page 13 and 14: Temperature (C o ) XILINX Typical C
Page 15 and 16: Jan. 1, 2002 P. 15 ESD and Latch-up
Page 17 and 18: (1) Measured on XC1765D (2) Measure
Page 19 and 20: Jan. 1, 2002 P.19 Failure Rate Summ
Page 21 and 22: Combined Lots: Failures: Device on
Page 31: Combined Lots: Failures: Device on
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Package Details Motherboard Design
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Package Motherboard Jan. 1, 2002 P
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Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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