Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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Jan. 1, 2002 P. 180 Reliability Testing Summary Package Qualification / Monitor PQFP-208 Device Type: Package Type: Die Attach Material: Molding Compound: XCS30XL, XCS40XL, XC2S150, XC4010E, XC95288XL XC4013, XCR3384XL, XCR3364XL PQFP- 208 Silver Epoxy Sumitomo 6300H, EME-7304LC, E7N36 & MP8000 Reliability Combined Device Mean Test Total Test No. Lots Failures On Test Hrs/Cycles Device Hrs/cycles Temperature cycle Pressure Pot Hast Solderability Bond Pull Lead Fatigue Salt Atmosphere Mark Permaanency Physical Dimension 24 3 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 1,259 126 15 3 5 3 15 3 5 1,039 129 100 1,307,509 16,296 1,500 ®
Jan. 1, 2002 P. 181 Reliability Testing Summary Package Qualification / Monitor PQFP-240 Device Type: Package Type: Die Attach Material: Molding Compound: XC4020XL,XC4013/XL/XLA, XCS30XL, XC2S150 XCV300/E/EA, XCV100, XCV200E PQFP- 240 Silver Epoxy Sumitomo 6300H, EME-7304LC, E7N36 & MP8000 Reliability Combined Device Mean Test Total Test No. Lots Failures On Test Hrs/Cycles Device Hrs/cycles Temperature Cycle Pressure Pot Hast 85/85 Solderability Resistance to Solvents Lead Fatigue Physical Dimension Salt Atmosphere Bond Pull Die Shear 12 5 6 2 5 5 4 3 1 3 1 0 0 0 0 0 0 0 0 0 0 0 601 175 293 82 15 15 12 15 15 15 5 1,040 113 100 1,114 624,821 19,752 29,300 91,377 ®
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Jan. 1, 2002 P. 1 The Reliability D
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Jan. 1, 2002 P. 3 TABLE OF CONTENTS
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Jan. 1, 2002 P. 5 2.1 Wafer Process
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Jan. 1, 2002 P. 7 2.3 Device Qualif
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Jan. 1, 2002 4. Failure Analysis: A
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Jan. 1, 2002 P. 11 F/A ACRONYM DESC
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Temperature (C o ) XILINX Typical C
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Jan. 1, 2002 P. 15 ESD and Latch-up
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(1) Measured on XC1765D (2) Measure
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Jan. 1, 2002 P.19 Failure Rate Summ
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Combined Lots: Failures: Device on
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Jan. 1, 2002 P.47 Combined Started
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Jan. 1, 2002 Combined Started Lot:
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Combined Started Lot: Combined Comp
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Page 217 and 218: Package Details Motherboard Design
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Page 221 and 222: Package Motherboard Jan. 1, 2002 P
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Xilinx Reliability Monitor Report - Quarter 4 CY 2001

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